Xcerra at SW Test Workshop
June 3 to 6, Rancho Bernardo Inn, San Diego, CA
5G Universal Test Interconnect Solutions for Advanced Testing at Wafer, Package or Module Level
Learn more about the most comprehensive portfolio for semiconductor test at the Xcerra booth #203
Xcerra has unique interface technologies that enable advanced testing of 5G devices at the wafer level and/or singulated with the same probe technology. The xWave technology allows placement of patch antennas in probe heads or contactors for Over-the-Air (OTA) 5G testing at the die, package, or module level. Using the same probe technology for wafer and package test reduce costs, reduces time to market, and improves overall consistency with 100% correlation between lab and production test.
Latest products at SW Test Workshop
Cost Efficient RF Contactor for Fine Pitch FBGA and Wafer-Level Packages
Optimal Performance for Large I/O Count Devices and High End Digital Test
Link Contactor Family
Optimal Performance for Analog, Mixed Signal, and RF Applications
Nexus Contactor – WLCSP Probe Head
Advanced Performance for WLCSP Test
Broadband Production Solution for cm Wave & mmWave up to 100 GHz
Visit our presentations
“Data Driven Comparison and Qualification of WLCSP Probe Technologies”
Date: Sunday, June 3
Time: 3:30 – 4:00 p.m.
Speaker: Bert Brost (Senior Product Manager)
Test probe selection decisions must be supported with verifiable and repeatable performance data. This includes the lab data describing the statistically predicted field performance of the test probe. Presented will be lab data describing the performance of several mainstream probe architectures for contacting Wafer Level Chip Scale Packages (WLCSP).
Click here to read the full abstract
“WLCSP xWave for High Frequency Wafer Probe Applications”
Date: Monday, June 4
Time: 3:30 – 4:00 p.m.
Speaker: Jason Mroczkowski (Director RF Product Development and Marketing IPG)
Today cmWave (3-30 GHz) and mmWave (30-300 GHz) applications have become mainstream. Packaging has become obsolete and wafers are becoming the new final test package. Testing automotive radar on wafer at 80 GHz and 150 degC was previously a fantasy, but is now a reality. With high power simulation tools and 110 GHz VNA’s it’s possible to design and fabricate hardware for these extremely high frequency, high temperature applications. Click here to read the full abstract