Mobility: Connecting anything – anywhere – anytime

  • Applications

    • 5G Connectivity
    • AR/VR Video
    • Mobile Display
    • Infrastructure
  • Market Attributes

    • high volumes
    • high quality demand
    • fast time to market
    • advanced packaging: WLCSP packaging, multi-die, Integrated packages, Integrated modules
    • small packages, fine pitch devices
    • low power devices
  • Xcerra Experience

    • market leader in PA testing
    • Flat Panel device testing
    • leading edge post saw testing and handling
    • experience in handling broad range of device types
    • high performance probe testing
    • extremely reliable fine pitch contacting
    • experience in test integration