SEMICON West 2018
Moscone Center, San Francisco, CA
Poster “5G Over the Air (OTA) Test Interfaces”
Date: Wednesday; July 11
Time: 12:15 – 1:30 pm
Speaker: Dan Campion and Jason Mroczkowski
Abstract: This poster will walk through test cell challenges of testing 5G devices with integrated antennae and explore some unique solutions for performing this testing in production. The 5G Antenna in Package (AiP) devices require OTA test solutions at the lab and/or production level depending on Cost of Test (CoT) budget and correlation. OTA test setups are complicated further by application variables, such as near field / far field, antenna integration level, and radiation orientation. The position of the test interface antennae from the device in the test setup could vary between a few millimeters to tens of centimeters depending on whether it is near / far field and the center frequency. These antennae can be integrated at the die, package, or module level. The radiation direction of the antennae can also be oriented to come out of the ball / pad, lid, or side of the device or module. These variables drive the test cell configuration beyond the norm and blur boundaries between the tester, contactor / probe head, and handler / prober to meet the test requirements. Although these 5G applications continue to evolve, integrated solutions to leading edge applications will be explored.
“5G Test Game Changers”
Date: Thursday, July 12
Time: 9:10 – 9:35 am
Speaker: John Shelley and Dan Campion
Abstract: This presentation/paper will take you on a journey of testing cmwave/mmWave devices in High Volume semiconductor Manufacturing (HVM). Many believe that testing high frequency devices with contacted test will be too expensive. Others believe that Over The Air (OTA) test for devices with Antenna in Package (AiP) will not cover enough parameters to ensure product quality. Both points have merit while cmWave/mmWave devices bring unknown parameters and fear due to a new paradigm. For years we have tested RF wireless devices both cellular and WiFi applications with many fundamentals in control due to years of experience. The next generation of 5G and in particular, Enhanced Mobile BroadBand (eMBB), has stirred the pot. With frequencies approaching 100 GHz the testing game will change.
This paper will investigate the challenges, opportunities, and techniques that will be utilized for testing the wide array of 5G device types and frequency bands. Larger frequency bandwidths have created challenges to meet the overall Cost of Test budget. HVM semiconductor test requires cohesive, quick, and efficient test flows. We will spend some time describing solutions that maintain the philosophies of HVM with great bandwidth test frequencies. Where the antenna is placed within these devices at the die, package, or module level has blurred the lines between the elements of the test cell. Integrated devices require integrated test solutions that can overcome the standard tester, contactor, handler boundaries. We will look at those opportunities where new solutions are required for cmWave/mmWave devices. In summary we hope to enlighten the test community to the challenges and solutions for test the next generation cellular devices while maintaining HVM philosophies.