Link Contactor Family

Optimal Performance for Analog, Mixed Signal, and RF Applications

  • Key Features

    • short signal path for comparable to solder-to-board performance
    • scrubs through surface oxides
    • easy field maintenance
    • contact motion decoupled from the test board
    • homogeneous material
    • self-cleaning contact tip
  • Benefits

    • high frequency >73 GHz @ -1dB
    • suitable for low-noise precision analog, mixed-signal, and RF/wireless devices
    • suitable for QFN, DFN, and other pad devices
    • suitable for SO, and QFP, leaded devices
    • pitches down to 0.35 mm
    • long uninterrupted test runs
    • site-to-site consistency on a global scale

Minimum pitch

Link 501 / 502: 0.35 mm

Link 301: 0.3 mm

Force

Link 501 / 502: 20 – 30 g

Link 301: 57 g

Loop Inductance

Link 501 / 502: 0.27 nH

Link 301: 0.15 nH

Bandwidth @-1dB

Link 501 / 502: 60.2 GHz

Link 301: 73 GHz

Contact Resistance (max.)

Link 501 / 502: 67 mOhm

Link 301: 43 mOhm

Pin Life

Link 501 / 502: 700 K

Link 301: 800 K