InCarrier® Process

Xcerra Test in Carriers

  • Highlights

    • strip-like device carrier for single device
    • no singulated after test
    • combines the advantages of the singulated device test with the advantages of strip test
    • robust handling for even smallest devices
    • high parallel test
    • flexible line set-up for loading, test and unloading
    • supports WL test and burn-in test
    • re-test option for single devices in the same equipment
  • Key Features

    • loading into strip-like device carriers with Xcerra loading equipment
    • supports standard transportation media of the backend process
    • leverages Xcerra InStrip for singulated packages
    • offers all features of the standard InStrip set-up
    • unloading into final packaging media
    • full traceability

  • Applications

    • leaded and leadless devices
    • large and smallest package sizes down to 1 x 1 mm
    • IC test
    • MEMS calibration test
    • WL packages

Advantages

The Xcerra InCarrier process is based on a strip-like device carrier for single devices that combines the advantages of the singulated device test with the advantages of high parallel strip test. Leveraging the strip like design the InCarrier ensures robust test-handling for even smallest devices and supports high parallel test.

Materials Flow

The InCarrier material flow at the test floor remains over all similar to the established standard process. Unlike strip test, the InCarrier test requires no singulation after test. Therefore the final test remains true final test. This way it overcomes the boundaries of strip test and meets the automotive 6 sigma – 0 PPM requirements.

Supported Transportation Media

The InCarrier loading supports all standard transportation media of the backend process:

  • tube
  • bulk
  • JEDEC tray
  • wafer ring