High-Volume Manufacturing Testing of 5G Power Amplifiers

Keysight and Cohu Extend Collaboration

Cohu co-authored a press release with Keysight on the integration of Keysight’s 5G NR Signal Studio and PXI modular instruments with Cohu’s HVM radio frequency (RF) test tools (click here to read the press release). The press release highlights the collaboration of the two companies developing an integrated solution, which simplifies correlation of measurement test results between design validation and manufacturing test.

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Cohu Completes Acquisition of Xcerra

POWAY, Calif.–(BUSINESS WIRE)–Oct. 1, 2018– Cohu, Inc. (NASDAQ: COHU) today announced the completion of its acquisition of Xcerra Corporation. The combination creates a global leader in back-end semiconductor equipment and services, and printed circuit board test with a breadth of products that are unmatched in the industry.

“The acquisition of Xcerra accelerates our strategy to diversify our product offerings and customer base, expanding Cohu’s addressable market to approximately $5 billion across semiconductor test and handling equipment, thermal subsystems, test contacting, vision inspection, MEMS and PCB test. This combination also further strengthens our ability to fully capitalize on the growth opportunities in our key target markets of automotive, industrial, IoT and communications,” said Luis Müller, Cohu’s President and CEO. “Although softening in the mobility market combined with current geopolitical uncertainty are creating near-term headwinds, we remain confident about the long-term growth opportunities in these markets as well as our ability to deliver on our synergy goals and to profitably grow Cohu in the years ahead,” added Müller.

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Innovative Impedance Controlled Test Contactor for Maximized RF Power Transfer

Xcerra receives first high volume order for ICON Coaxial Contactor

Xcerra’s new ICON contactor is designed specifically for maintaining the native impedance of the device-under-test (DUT) through the contactor to the test system. Functional and AC parametric testing of high speed devices requires a high and bandwidth low noise interconnect to maintain the quality and/or fidelity of the test signal. As an impedance controlled contactor the ICON maximized high frequency power transfer by minimizing signal reflections (Return Loss).

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The World’s First 75 dB SNR Microphone Test Cell

Xcerra successfully introduced high parallel complete test cell solution for high-quality microphones

Xcerra successfully installed three microphone test cells for high parallel testing of high-end microphones featuring a signal-to-noise ratio (SNR) of 75 dB. This solution ideally supports microphone testing for mobile phones, tablets, other state-of-the-art consumer applications.

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Diamondx Well Positioned to Ride the TDDI Wave

Xcerra’s flagship test platform brings flexibility and scalability to display driver test

Xcerra’s highly flexible Diamondx test platform can scale up to over 5000 display driver digitizers, supporting aggressive multi-site production strategies. With a wide range of general purpose and specialized instruments, the Diamondx platform meets the current and future test requirements of display driver devices, as well as the complete spectrum of multimedia ICs.

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Enhancing Test Floor Performance and Quality: New options for the MT2168 XT

Xcerra’s MT2168 XT Semiconductor Test Handler now available with advanced Double Device Detection and Automatic Temperature Calibration

Xcerra has added two new optional features to the MT2168 XT pick-and-place handler. Both options target optimization of test floor processes, allowing the customer to deliver enhanced quality: the Double Device Detection (DDD) option increases binning integrity; the Automatic Temperature Calibration enables the customer to meet quality standards by calibrating as scheduled without time consuming manual processes.

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Xcerra Announces Microchip Technology as the Recipient of the 500th Diamondx Test System

Diamondx Semiconductor Test System Used in Testing a Broad Range of Device Types for the Automotive, Consumer, Industrial and Mobility markets

Xcerra announced that is has shipped the 500th Diamondx test system reaching a critical milestone for Xcerra’s flagship system-on-a-chip (SOC) test system. The 500th test system was delivered to Microchip Technology, the number three supplier of microcontrollers in the world. Microchip will add to their installed base of Diamondx testers in support of high volume production test of devices supplied into the automotive, consumer and industrial markets.

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Meeting the Test Needs of Next Generation Application Processors

Xcerra introduces HSI1x 12.8 Gbps SerDes test instrument with industry-leading channel density and performance

The new Xcerra HSI1x instrument for the well-established Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate. The instrument can be used for protocol and physical layer testing of leading edge SerDes ports, such as MIPI, PCIexpress, VbyOne, HDMI and USB, found on the latest applications processors, flat panel display devices, and other high performance ICs.

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Testing of LED Devices with Superior Temperature Performance

Xcerra’s MT9510 XP pick and place handler proven as reliable solution for tri-temperature testing of LED devices in volume production

The Xcerra MT9510 XP pick-and-place handler successfully passed the onsite buy-off for an automotive LED test application at a leading lighting manufacturer. The MT9510 XP solution enables the customer to test high volumes of LED devices with best temperature performance.

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Testing Modules and Multi-Chip Packages in the Full Temperature Range

Xcerra’s MT2168 XT Semiconductor Test Handler installed as a flexible and efficient alternative to dedicated module test solutions

The Xcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.  With its innovative features and highly flexible design the MT2168 XT meets the growing demand in high volume production for reliable and cost-efficient tri-temp test handling of multi-chip packages and modules in the automotive and consumer markets.

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