InCarrier Loader plus Dedicated to High Volume Production

Multitest launches the next generation loader for test in carriers

Multitest is launching the first InCarrier Loader plus with the shipment to a major IDM with high volume production in Europe and Asia.
The InCarrier Loader plus is the new state-of-the art loading solution for test in carriers. It is designed to optimize the back-end process at high volume production sites. The InCarrier Loader plus supports device loading to carrier from standard back-end transport media in a most cost-efficient and productivity-oriented way.

Since Multitest introduced the InCarrier concept to leverage the advantages of strip handling for singulated packages, this process has been well-accepted in the market. Up to now more than 3 billion packages were tested on InCarrier set-ups. The customers fully benefit from the robust, high parallel test solution. The advantages are particularly recognized for large production lots, long test times and/or small packages.

The InCarrier Loader plus is minimizing cost of loading and increases throughput up to 16,000 units per hour depending on packages sizes. The InCarrier Loader plus has been optimized for smaller footprint and requires less space on the test floor. The InCarrier Loader plus is supporting standard back-end transport media – such as JEDEC trays and bulk – and can be smoothly integrated in state-of-the-art production flows and lines. On the test floor the InCarrier Loader plus / InStrip solution can be combined with standard final packaging equipment for tape & real, tube or tray output and fits therefore seamless into the production process.

Andreas Nagy, Senior Director Marketing commented: “Multitest was the first supplier who actually offered the test in carrier solution – the first Multitest InCarrier Loader / Unloader was launched as a dedicated loading and unloading tool. The InCarrier Loader plus leads this concept to the next level of overall productivity improvement. This gets achieved by significant loading cost reduction at the InCarrier Loader plus and the elimination of the additional unloading steps, because the trays with the tested devices will be processed directly by traditional final packaging equipment for high volume production.”

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High Volume Test and Calibration of Barometric Sensors

Multitest InBaro confirmed as platform of choice

Multitest successfully introduced a new solution to their MEMS test and calibration portfolio: Multitest InBaro for high parallel test of barometric sensors. During a benchmark evaluation at a major European semiconductor manufacturer the InBaro specification outperformed the competition and was selected as the standard platform for test and calibration of their barometric sensor devices for consumer applications.

The InBaro provides a reliable multisite test and calibration solution for barometric pressure sensors and gas detection sensors for e.g. 144 and more devices in parallel with a maximum signal count of 2400 pins per insertion. It enables temperature test at a range form – 40°C up to +125°C with best temperature accuracy and stability. The InBaro standard configuration supports quick exchange between five pressure levels – more can be added on request. InBaro features absolute pressures up to 1,500 mbar. The InBaro can be upgraded to “InHumid” to expand the application to other environmental sensor devices.

As an addition to the Multitest InMEMS portfolio the InBaro continues the modular concept, which allows for highest flexibility and reuse of equipment. Based on the InStrip handler, which can process packages in strips or carriers, all InMEMS modules fully leverage the highly stable package handling and ease-of-operation to ensure production proven high throughput and overall equipment efficiency (OEE).

Andreas Bursian, Product Manager, comments: “With InBaro our focus is to provide a solution for high volume production of barometric pressure sensors. We understand the urgency in consumer application field for best productivity and return on investment to meet the volume and cost targets. The customer appreciates the production proven modular concept of InMEMS, which convinces with the ease of operation and low maintenance requirements. Based on the InMEMS architecture the InBaro set-up can be easily converted for other MEMS test applications. The ability to upgrade the InBaro to InHumid is in line with the anticipated developments in the consumer applications area.”

Multitest offers a variety of solutions for test and calibration of pressure sensors in strips or singulated. The portfolio ensures that the actual test requirements in terms of pressure level, package type and production volume will be matched.

Learn more about Multitest MEMS and sensor test and calibration

Cost-efficient and Flexible Solution for Managing Power Dissipation

Multitest ATC for the MT2168 Pick-and-Place Handler

The Multitest ATC option for the MT2168 pick-and-place handler offers a most cost-efficient and flexible solution for managing low to medium range power dissipation at multisite test cells with up to 16 sites. Multitest ATC is an easy add-on to the standard MT2168, which can be mounted and demounted effortless. Multitest ATC is an affordable, reliable and flexible solution for test development and high volume production.

In the past power dissipation was recognized as an issue for high performance server, processor and graphic applications. Today package density and integration increases more and more to achieve higher speed and save space particularly in mobile applications. The power dissipation here is significantly less than in the high performance applications. However, thermal stress may damage the packages, temperature test may be distorted and test repeatability and yield lost. Additionally, there is a higher cost pressure for this market, which requires best cost of test configurations.

Multitest meets this need for managing power dissipation with the ATC add-on to the MT2168. No dedicated equipment is required, but all ATC functions are delivered by parts of the conversion kit. The operation is unchanged to a standard set-up and no dedicated training or spare part management is needed.

The Multitest ATC ensures highest flexibility. It can easily be mounted, demounted and changed to other MT2168 handlers in the field. Any standard MT2168 can be configured with this add-on, but will be available for standard test again once the add-on will be removed.

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Multitest’s MEMS and Sensor Test and Calibration Portfolio Supports the Increasing Functionalities of Mobile Phones

Multitest meets performance and cost requirements of today‘s mobile applications

The Multitest has been providing MEMS and sensor test and calibration equipment for more than ten years. Originally driven by the automotive market Multitest continuously expanded the product offering to meet the needs of consumer and mobility applications. Today Multitest provides solutions for accelerometers, gyroscopes, pressure and gas sensors, humidity sensors, magnetometers, microphones, optical sensors and oscillators. The set-ups cover test of singulated packages, high-parallel testing up to multi-DOF test.

The features and functionalities of smartphones significantly grew. Portrait/landscape switching, pedometers, gaming, navigation have been complemented by location-based services, 3D gaming, advanced user interfaces, high-resolutions camera stabilization, and authentication. Barometric features, indoor navigation and activity monitoring have been the latest enhancements. Analyzing the bill of materials of the recently launched smartphones gives some insight, which types of sensors are deployed to enable this: accelerometers, gyroscopes, proximity, compass and barometers. In the more advanced phones gesture and heart rate sensors are integrated.

Andreas Nagy, Senior Director Marketing Handler & TCI comments: “Based on our experience and the comprehensive portfolio we are able to fully cover the technical requirements. Moreover, our equipment concept addresses the also business challenges in this fast moving and volatile market: high volumes, fast ramping, and substantial cost pressure. Our solutions are modular, flexible and re-configurable and support high parallel test of both – strips and singulated packages. For combo sensors multi-stimuli solutions up to 9 DOF are available. Within the Xcerra group we are able to deliver a turnkey MEMS/sensor test call including testing (ATE), MEMS/sensor actuation and package handling. This way our customers are able to combine the advantages of a complete solutions with the substantial benefits from a modular concept.”

Learn more about Multitest MEMS and sensor test and calibration

MT2168: Package Characterization at Cold Conditions

Leveraging the benchmark for ambient/hot test for tri-temp qualification

The Multitest MT2168 pick and place handler now offers the ability to characterize devices at cold conditions. This addresses the evolving requirements for temperature performance driven by applications in the end markets. Whereas final test of the respective devices in high volume production will only be done at ambient/hot, they need to get qualified for cold conditions before they ramp. The “Cold for Characterization” option of the MT2168 allows for using the one platform for qualification and final test without the need to invest in more complex and more expensive tri-temp test equipment.

The “Cold for Characterization” set-up of the MT2168 is an add-on to the standard base unit, which does not require changes in the handler itself. All required features are part of the conversion kit set. The customer can decide, whether he wants to use existing external chillers or if he prefers to have a LN2-based heat exchanger integrated. The “Cold for Characterization” option provides temperature conditioning directly at the contact site and sticks to the chamberless concept of the MT2168. This way no icing issues or defrost needs occur.

Günther Jeserer, Vice President for Gravity and Pick & Place Handling explains: “The MT2168 ‘Cold for Characterization’ meets the needs of the qualification teams at our customers: They can rely on the ease-of-operation of ambient/hot system but can do their full temperature characterization. With changing temperature performance requirements in the consumer markets and new car convenience and car entertainment applications in the automotive market, we anticipate a shift from strict tri-temp test in volume production to cold qualification before ramping. The MT2168 is the only handler with this ability, which is well received by our customers.”

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Cost-efficient Fine Pitch Load Boards Meet Market Needs

Multitest PCBs are leading the way for 0.3 mm pitch array applications

Multitest has again increased its lead over the competition for fine pitch load boards. Advancements in proprietary plating processes along with new technology in drilling and registration techniques ensure reliability, short cycle times and low cost. Multitest has responded to the needs of its customers in the very price sensitive mobile applications and vertical probe cards markets.

Fine pitch printed circuit boards are still a challenge in ATE board the industry, but Multitest leverages its expertise in single lamination high aspect PCBs to support the demands of fine pitch BGA and WLCSP applications. Based on many years of experience building high aspect ratios, Multitest deploys state-of-the-art equipment in a stable process to use mechanical drilling for 0.3mm & 0.35mm pitch via in pad constructions. PCBs with 40+ layers at .35 mm can be manufactured in a single lamination process without the use of laser drilled, “stacked”, blind vias.

Christopher Cuda, Product Manager, comments: “Using our established and continuously refined fabrication processes for 0.3 & 0.35mm geometries enables us to meet today’s requirements at reasonable cost and with the reliability customers have come to expect from Multitest.”

 

Strip Test for Automotive Applications

European IDM selected Multitest InStrip for high parallel test in automotive production

Multitest InStrip® test handler has been already well-established at a number of different customers in Asia, Europe and US. Recently, Multitest received a multiple order from European IDM that will leverage the high-parallel test capability for standard SOCs for the automotive market.

In the past strip test was considered not be appropriate for applications with high quality requirements – such as automotive or medical – because singulation of the packages would have to take place after testing. Multitest‘s InCarrier concept overcomes these issues and combines the substantial advantages of the strip handling process with the quality driven advantages of the standard test handling process. “Although the automotive market is driven by high quality requirements, reduced cost of test will give our customers a competitive advantage. High parallel strip test will substantially increase their test efficiency”, explains Peter Killermann, product manager.

The Multitest InStrip is known for production proven performance in tri-temp strip test of standard ICs and MEMS. Leading contacting technology, outstanding temperature performance, ease of use as well as greatest flexibility make the InStrip® the optimal solution for high volume final test. Advanced device tracking features as well as factory automation options like recipe management and remote system control support the high quality demands of the automotive users.

“High temperature performance and tri-temp capability is a standard requirement in the automotive market segment. The Multitest InStrip particularly convinced with the proven temperature accuracy and stability for the entire carrier”, concludes Killermann.

Learn more about Multitest strip test solutions