Everett Charles Technologies: Change in VG Brand of ATE Mass Interconnect Products

Everett Charles Technologies (ECT) has some important information to share related of the VG brand on ATE Mass Interconnect products.

The management of this brand and product family will transition from the ECT Fixture and Service Group (FSG) to the ECT Contact Products Group (CPG). This transition will allow improved focus on the affected products, and ultimately an improved experience for our customer base.

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High Throughput for Testing Oversized PCBs

atg Luther & Maelzer extended its range of Flying Probe Test Systems to support oversized test areas up to 40” x 60”

atg Luther & Maelzer GmbH extended its range of Flying Probe test systems by launching a line for test areas up to 40” width. The oversized system complement the standard line which can load boards with sizes of up to 27” width.

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Meeting the Test Needs of Next Generation Application Processors

Xcerra introduces HSI1x 12.8 Gbps SerDes test instrument with industry-leading channel density and performance

The new Xcerra HSI1x instrument for the well-established Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate. The instrument can be used for protocol and physical layer testing of leading edge SerDes ports, such as MIPI, PCIexpress, VbyOne, HDMI and USB, found on the latest applications processors, flat panel display devices, and other high performance ICs.

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Testing of LED Devices with Superior Temperature Performance

Xcerra’s MT9510 XP pick and place handler proven as reliable solution for tri-temperature testing of LED devices in volume production

The Xcerra MT9510 XP pick-and-place handler successfully passed the onsite buy-off for an automotive LED test application at a leading lighting manufacturer. The MT9510 XP solution enables the customer to test high volumes of LED devices with best temperature performance.

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Testing Modules and Multi-Chip Packages in the Full Temperature Range

Xcerra’s MT2168 XT Semiconductor Test Handler installed as a flexible and efficient alternative to dedicated module test solutions

The Xcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.  With its innovative features and highly flexible design the MT2168 XT meets the growing demand in high volume production for reliable and cost-efficient tri-temp test handling of multi-chip packages and modules in the automotive and consumer markets.

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Superior Cantilever Contacting Solution for High Parallel QFP Testing

New HD Kelvin Contactor passed evaluation for volume production

Xcerra’s new HD Kelvin contactor successfully passed a long term evaluation at a major IDM. The application deploys the HD Kelvin for a multisite Kelvin test of a QFP 100 package for the automotive market. Xcerra’s HD Kelvin fully supported the customer’s target to double the test sites and moreover significantly exceeded the customer’s expectation in terms of life span.

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ECT General Purpose Probes for Board, Module and Final Assembly Testing:

Combining the advantages of a comprehensive off-the-shelf portfolio with in-house design and manufacturing

Everett Charles Technologies (ECT) offers a comprehensive portfolio of off-the-shelf probes for board, module and final assembly test, which are available at short lead times. For applications, in which ECT’s vast selection of off-the-shelf probes doesn’t meet the requirements of the specific application, ECT’s in-house design and manufacturing resources will develop the solution that addresses the dedicated needs.

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Over-the-Air (OTA) Integrated Test Solution for Antenna in Package (AiP) 5G, Auto Radar, and WiFi Devices to > 80 GHz

Xcerra combines innovative contacting technology with reliable test handling solution

Multitest recently delivered a production interface solution to a customer for OTA testing of a 60 GHz UltraGig single-chip integrated Antenna in Package (AiP). The solution integrates the xWave OTA Contactor with xWave patch antenna in the MT2168XT leadbacker.

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Substantial Yield Improvements with ECT’s LFRE Probes for PCBA Testing

ECT probes with proprietary Lead-free plating passed extensive qualification at a major US based OEM

Everett Charles Technologies’ (ECT’s) LFRE plated probes successfully passed an extensive qualification testing with an incumbent probe at a major US based OEM for power infrastructure equipment. ECT’s LFRE proprietary plated spring probes demonstrated a significant improvement in first pass yield and fully met the customer’s expectations in contact reliability and probe life.

This customer’s fist pass yield was negatively impacted by continuity fails due to poor contact. In head to head testing with traditional gold plated probes, LFRE plated probes offered a more reliable contact, lasted longer and required less cleaning in high volume production test applications.

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atg Luther & Maelzer to exhibit at CTEX 2018, in Suzhou

New Generation Flying Probe Test and Innovative Grid Test Equipment

atg Luther & Maelzer will exhibit its leading test solutions for PCBs at the upcoming CTEX 2018 show scheduled to take place May 16 -18, 2018 at the Suzhou International Expo Center, China.

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