ACE Contactor or WLCSP Probe Head

Cost Efficient RF Contactor for FBGA and Wafer-Level Packages

  • Features

    • high frequency >40 GHz @ -1 dB
    • exceptional DC and RF performance
    • revolutionary barrel-less architecutre
    • HyperCore – homogeneous DUT side plunger material
    • high-precision manufacturing process
    • large contact surface between top and bottom plungers
    • singulated devices and strip test
    • BGA, LGA, QFN
    • pitches down to 0.4 mm
  • Benefits

    • compatible with all device types, platings, and pitches
    • consistent electrical performance
    • long life and lower cost of test