Combining Leading Temperature Performance with Highest Flexibility for Pick and Place Handling

Multitest has shipped the first MT2168 XT for ambient/hot/cold applications

Multitest shipped the first MT2168 XT tri-temp pick and place handler to a major IDM. The MT2168 XT combines the innovative architecture of the MT2168 ambient/hot handler with leading temperature test performance, for which Multitest has been known for decades. The MT2168 XT offers greatest flexibility and best performance for highest return on investment and lowest cost of test.

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High Volume Testing of Fingerprint Sensors with Multitest InStrip

Major OSAT deploys Multitests solution for an application of one of the worlds leading fingerprint sensor companies

Multitest’s InStrip has been selected to be the platform of a set up for high parallel testing of fingerprint sensors in China. The solution relies on Multitest’s well established and production proven InStrip / InCarrier, which is extended to fingerprint testing by a dedicated conversion kit (CK).

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Multitest Introduces ACE Contactor:

Cost-efficient contactor solution for best RF performance

Multitest recently introduces the ACE Contactor, which offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages at an attractive. Typical applications for this new contactor are Power Amplifiers, RF switches and mobile communications.

The ACE probe has a revolutionary, which provides exceptional electrical performance, both DC and RF. The ACE probe is manufactured from HyperCore™ base material, which is a proprietary material of Xcerra’s ECT Contact Product Group. HyperCore™ combines the mechanical properties of high carbon steel, with the electrical properties of BeCu and non-oxidizing properties of a precious metal.

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High Performance Probe for Lead-Free Fine Pitch PCBA Test Applications

Everett Charles Technologies launches LFRE-39 probe

Everett Charles Technologies (ECT) introduces the LFRE-39 spring probe to complete its comprehensive portfolio of products for lead-free test applications.  LFRE-39 features ECT’s LFRE™ plating and is designed to meet fine pitch requirements down to 39 mil (1.0 mm). The LFRE-39 fully meets the demanding requirements of high volume production in-circuit and functional test.

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ChipMOS Selects Xcerra’s Test Cell Solution to Support High Volume MEMS Device Testing

ChipMOS purchases multiple integrated test cells for Shanghai factory

After evaluating several alternatives ChipMOS has selected Xcerra’s total test cell solution as their preferred test platform for high volume production of MEMS devices at its Shanghai facility. ChipMOS is an industry leading provider of semiconductor assembly and test services with factories in Hsinchu and Southern Taiwan Science Parks in Taiwan and Shanghai. ChipMOS is now well prepared to support further MEMS fabless and IDM customers’ mobility, automotive and IOT volume production requirements for MEMS calibration and test in Shanghai.

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