Conversion Kit Design Makes a Difference

Multitest launches local kit design team in the Philippines

Multitest makes a significant step to expand customer support. Starting May 2015 an additional design team for conversion kits will be supporting the needs of Asian customers. The local design team based in the Philippines will be the expert contact for kit related requests of customers and ensure shortest response times.

Efficient handling solutions are often based on appropriate design of the conversion kits. Customers will be able to explain their requirements directly to the designers and  will receive immediate feedback on the available design options. Understanding the conditions of each alternative provides a better basis for decision making.

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ECT’s Launches New Probe Family for RF Signal Testing of PCBAs and Industrial Applications

CSP-40 significantly reduces cost per insertion with best best electrical performance at competitive pricing

Everett Charles Technologies (ECT) recently launched a new line of high frequency test probes for the PCBA and industrial test markets. The
CSP-40 high frequency probe family offers high reliability and excellent electrical performance at competitive pricing and significantly reduces the cost per test insertion.

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Combining Flexibility and Throughput Improvements for Sensor Test

Multitest has shipped first 45° high g sensor test module for kitable MT9928 gravity handler

Multitest shipped the first “Shaker” 45° high g sensor test module for the MT9928 to a major international IDM. The module allows for a two axis testing with one single stimulation on a flexible and modular handler platform. The well-established “Shaker” module, which was originally available for the MT93xx only, is now also available for the flexible and modular MT9928 gravity handler.

The MT9928 has a kitable and modular architecture and therefore can be converted to different package types and configured with various loading and unloading options. The generic Multitest MEMS test approach deploys all features and functions of the standard handling system and meets the MEMS specific requirements by adding MEMS/sensor test and calibration carts with dedicated stimulus boxes.

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ECT’s ZIP™ Probe for Semiconductor Test Exceeds Customer Expectations

ZIP probes built from HyperCore™ base material proved superior performance in high volume production

Everett Charles Technologies (ECT) successfully passed a two month evaluation of ZIP probes using the HyperCore material option in a high volume production environment at a large OSAT in Singapore. The ZIP probe exceeded the critical first pass yield expectations and beat the target for a 500 k insertions life time by over 20%.

ZIP is one of several semiconductor test probe families offered by ECT. For this evaluation the ZIP probe was deployed in a quad-site test set-up for a 250 BGA package with 0.8 mm pitch for an Ethernet/MoCA (Multimedia over Coax Alliance) end application. The test was done at ambient and hot (85°C) conditions.

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