Offset Vertical Probe with Scrub Design for Best Test Yield and Lowest Cost of Test

Multitest Adds Link Contactor to Its Interface Products Portfolio

Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.

Read more

atg Luther & Maelzer Launches Flying Probe Tester for Substrates

S3 High Speed Substrate Tester for Structures Down to 10 µm

atg Luther & Maelzer has delivered the first flying probe system for substrate test to a major customer in Korea. The S3 10 µm Substrate Tester is the first system of a new atg Luther & Maelzer product line. It meets the challenging requirements of high end substrate test such as positioning accuracy and high number of contact points by applying the advanced flying probe technology of atg Luther & Maelzer.

Substrates are used to enable a connection between a semiconductor and a printed circuit board. A characteristic test panel consists of about 50 – 100 single substrates and has a size of approx. 250 mm x 80 mm. For electrical testing it is necessary to contact all end points of the product. Each substrate has about 1000 – 2000 test points. So on one product about 100,000 pads need to be contacted. For testing substrates on the semiconductor side, structure down to 10µm have to be reliably contacted.

Read more

Multitest Adds Link Contactors to Its Interface Products Portfolio

Offset Vertical Probe with Scrub Design for Best Yield and Lowest Cost of Test

Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.

Read more

InCarrier plus Dedicated to High Volume Production

Multitest launches the next generation loader for test in carriers

Multitest is launching the first InCarrierplus with the shipment to a major IDM with high volume production in Europe and Asia. The InCarrierplus is the new state-of-the art loading solution for test in carriers. It is designed to optimize the back-end process at high volume production sites. The InCarrierplus supports the device loading to carrier from standard back-end transport media in a most cost-efficient and productivity-oriented way.

Read more

New Flying Probe PCB Tester for Large Format, High Layer-Count

Backplanes: atg Luther & Maelzer releases the A7-20

atg Luther & Maelzer a company of Xcerra Corporation, announces the release and the first installations of the new A7-20 flying probe test system. Specifically designed for the demands of large format, high layer count backplanes, the A7-20 combines the flexibility typical for flying probe testers with accuracy and speed. The A7-20 significantly reduces test time and test cost.

The market segment for the A7-20 are large server and back panel designs for the telecommunication industry. These kinds of designs have up to 72 layers with a product weight of up to 30 kg (66 Ibs). 100.000 test points are very common on formats of up to 1.25 m (50 inches). In combination with higher density electrical test comes challenging. Traditional test solutions such as four-head probe systems or multiple oversized test fixtures for grid systems cannot fully meet the requirements in terms of speed and cost.

Read more