WLCSP Test: Efficient High Volume Solution for Post-Saw Testing

Multitest InWaferX for final test of singulated WLCSPs

Multitest’s new InWaferX final test solution for singulated WLCSPs addresses the increased quality demand for automotive applications as these quality requirements are expanding to cost sensitive, high volume consumer applications. Based on the production proven InCarrier technology, InWaferX ensures highest efficiency and yield for lowest cost of test.

The InWaferX solution enables post saw testing of singulated WLSCPs detecting all production defects in true final test of singulated devices. In addition, the same process can be deployed for retest and RMA process handling. Both options significantly enhance the production quality of the shipped devices and substantially support the zero defect parts per million (ppm) efforts of the device makers. In addition the InWaferX is equipped with a full 6 side vision inspection capability for complete physical validation.

InWaferX combines high multisite testing with the highest positioning accuracy for best yield and 100% touch efficiency on the rectangular carrier trays. InWaferX supports the high daily output requirements in today’s high volume manufacturing (HVM) environments.

Based on the well-established InCarrier / InStrip solution, the InWaferX supports full range temperature testing, as well as, MEMS/sensor testing. The InWaferX final test solution can be applied for WLSCPs from sawn film frame or tape and reel.

Andreas Bursian, Senior Director Innovation, comments: “We did extensive system validation on a production test floor and passed all requirements such as ESD, safety and operational conditions. Compared to the traditional wafer probing, the InWaferX test solution has proven to increase test throughput and outgoing device quality.

To learn more about the Multitest InWaferX solution based on the InCarrier, please visit http://multitest.com/incarrier/