Xcerra at SEMICON China 2018
Shanghai New International Exhibition Centre
Visit our expert presentation
Next Generation WLCSP Contacting Technologies for 250 Micron Pitch and Below
Date: Sunday, March 11
Time: 3:15 – 3:40 pm
Session VI: Emerging Technologies – II
Speaker: Bert Brost (Senior Product Manager)
Spring probes are becoming a viable alternative to traditional probe card technologies in testing WLCSP devices.
Manufacturing spring probes at this scale is very challenging, and various suppliers have taken different approaches to building them. This presentation will explore the various probe architecture that are commercially available, and present detailed mechanical and electrical lab performance of each style. Each contact technology will be presented from a mechanical and electrical reliability standpoint, as well as cost and complexity.
Click here to read the full abstract