SEMICON West 2017
Moscone Center, San Francisco, CA
As we move to a new wireless paradigm, test methodologies are also starting to take shape. Today’s model for high volume manufacturing will change in the near future to meet the economies of scale for device production. High frequency signal handling, cost and device integration will drive high volume manufacturing test to new strategies. Industry conversations are also indicating that Multiple Input Multiple Output (MIMO) will continue to evolve as an effective technique for higher data rates. Fifth Generation (5G) cellular signals, having smaller wavelengths, create opportunities for device manufacturers to assemble wireless semiconductors with antennas into very small packages sizes. MIMO structures with mmWave is making 2X2 and 4X2 MIMO connection schemes in handheld devices possible. At centimeter and millimeter wave frequencies, connected test will become very expensive at a very rapid rate. To overcome this challenge test will look towards incorporating Over the Air (OTA) test. OTA promises to overcome expensive mmWave connectivity but comes with challenges unknown to many. Lastly, loopback testing has been utilized for many years in certain markets and the question is whether this strategy will be acceptable for 5G in the future. In this paper we will discuss the challenges of test for 5G cellular including device integration, mmWave, OTA and loopback testing for high volume manufacturing.