Visit our presentation “Fan-In WLCSP Test Strategy”
Date: Thursday, December 14
Time: 1:50 – 2:20 pm
STS Packaging Session 1: Fan-out Wafer Level Packaging Technologies
Speaker: Nigel Beddoe (Global Business Development Director – Handler Group)
Wafer Level Chip Scale Package (WLCSP) devices are used because they offer very low cost, small footprint packages to be directly mounted into smartphones, tablet’s, other mobile devices and automotive applications. The type of technologies targeted for fan-in WLCSP packaging include PMIC’s, transceivers, microcontrollers, IoT applications, MEMS and more. This paper will explore how the demand from system manufacturers for lower defect parts per million (DPPM) from their suppliers is changing the back end processing of these devices.
Today, the backend process flow for WLCSP devices is a single insertion test at wafer sort. With this flow, there is no testing done after device singulation (wafer saw). The reason for this flow is that there has been no cost effective way to handle singulated WLCSP devices in high volume manufacturing environment. Other challenges include requirements for increased vision inspection to detect devices that may exhibit early life failures. The industry is looking for ways to cost effectively increase the outgoing quality of these devices. This paper reviews the different challenges and techniques for enabling post saw test.
Challenges to be explored include
- high volume manufacturing at low cost
- accuracy requirements for highest possible yield at full multi-site
- temperature testing
- support for MEMS applications
- vision inspection
Visit our presentation “5G Market Trend and Testing Challenges”
Date: Friday, December 15
Time: 1:40 – 2:05 pm
STS Test Session: Quality and Cost Challenges for Connected Devices
Speaker: John Shelley (Director, Global Business Development)
As we carve into a new wireless paradigm, test methodologies are sharpening up also. The model for high volume manufacturing known today will change in the near future to meet the economies of scale for device production. High frequency signal handling, cost and device integration will drive high volume manufacturing test to new strategies. Fifth Generation (5G) cellular signals, having smaller wavelenghts, create opportunity for device manufacture’s to assemble wireless semiconductors with antennas into very small packages size. At centimeter and millimeter wave frequencies, connected test will become very expensive at a very rapid rate. To overcome this challenge test will look towards incorporating Over the Air (OTA) test. OTA promises to overcome expensive mmWave connectivity but comes with challenges unknown to many. Lastly, loopback testing has been utilized for many years in certain markets and will this strategy be acceptable for 5G in the future? This presentation will examine a few challenges of test for 5G cellular including device integration, mmWave, OTA and loopback testing for high volume manufacturing.