October 25 – 27, 2016
Seminar: “Changing the Way You Test”
At this Seminar, we will be exploring the broad, divergent requirements of the mobility, industrial, automotive and consumer end markets looking at the full range of test requirements. We will discuss market drivers, requirements and solutions for test, contacting and handling in the semiconductor market.
Date: Wednesday, October 26, 2016
Time: 2:00 – 5:00 pm
Location: Belle étoile, Alpexpo
1:30 – 2:00 pm: Registration
2:00 – 2:30 pm: Keynote – Market drivers effect on back end test (Pascal Ronde, Senior Vice President Global Customer Team)
2:30 – 3:30 pm: Semiconductor Test
Changes in the RF market and its effect on test
Trends in SoC (ASSP), IoT, Consumer, Automotive Market: How to test?
3:30 – 4:30 pm: Test Handling Solutions
High Volume MEMS and Sensor Handling requirements
Next Generation Pick and Place Handler
4:30 – 5:00 pm: Test Interface Products
Contacting solutions for mmWave, RF, and Power Applications
The seminar is free of charge.
Pre-registration is required:
Since there are a limited number of seats available advanced registration is required for this event.
<< REGISTER HERE >>
For additional questions please contact Antoinette McKinley at firstname.lastname@example.org
Visit our presentation
Advanced Packaging Conference
(for more info click here)
Title: WLCSP Test Contact Performance and Reliability
Date: Wednesday, October 26
Time: 10:05 – 10:30 am
Speaker: Bert Brost (Product Manager)
The wafer level chip scale package (WLCSP) has emerged as one of the best device packaging solutions for the continuing trend towards smaller, thinner, lighter, and less power end products. Compared with face up wire bonding flip chip, WLCSPs provide the shortest possible leads, the lowest inductance, the highest frequencies, the best noise control, the highest density, and the greatest number of I/Os in the smallest device footprints with the lowest profile. This package/device performance should not be compromised by the interconnect between the sophisticated testing systems and the WLSCP device-under-test. WLCSP contactors and probe heads can have a direct impact on signal fidelity along with impacting testing costs, test system uptime, production yields, and the number of good units shipped per shift, per day, etc..
The new generations of densely packaged, high-speed semiconductors in WLCSPs demand a high level of electrical interconnect performance to the test system while supporting multisite test for high levels of parallelism. The level of electrical performance required at test may not be attainable with traditional vertical probes and buckling beam probe technology. In test, WLCSP contactors and probe heads provide a vital link between the sophisticated high speed testing system and the increasingly complex WLCSP integrated circuits. As the vital link, contactors and probe heads must have the DC to GHz bandwidth for testing everything from digital computing devices to high frequency RF devices at ambient, cold and hot test temperatures.
In addition to electrical performance, mechanical reliability and ease of maintenance have always been regarded as the necessary attributes of a high performance contactor. These same reliability and attributes must be applied to WLCSP contactors for ensuring long probe life and long uninterrupted run times between cleanings and maintenance.
This paper will describe how high performance test spring probes are being designed and deployed to meet the electrical requirements of today’s WLCSP testing environment, without sacrificing mechanical performance. In addition , the paper will provide information on WLCSP test sockets designed to standard size and footprint required for single and multisite contacting in automated test and manual/hand test. WLCSP spring probe contactors designs are reducing the cost to acquire and the cost to use while increasing WLCSP test throughput