Multitest’s Unique Interface Solution for Ultra-High Frequency Testing Delivers Unprecedented Life-Time in Volume Production

mmWave customer case presented at Test Vision

Multitest’s mmWave contactor is a proven broadband production solution for RF applications up to 100 GHz. In a presentation by Jeffrey Finder, Senior Product and Test Engineering Manager at NXP, named “Building a Test Ecosystem for High Volume Manufacturing of 76-81 GHz Semiconductor Radar Sensors” the repeatable and stable performance of mmWave contactor was highlighted for an Automotive Radar Sensor Chipset application. This presentation was given at the Test Vision 2020 workshop at Semicon West in July 2017.
(Download the full presentation here: Download)

As stated in the presentation, NXP has been using the mmWave contactor in production since Q3 of 2016. In the presentation Jeffrey stated that a recent modification in the materials of the mmWave contractor biasing element translated to a 400% increase in the number of insertions for production testing of their 76-81GHz radar sensor. Multitest has implemented this new biasing element material in the mmWave contactor after thorough internal lab testing leveraging the long-term experience and expertise in contactor design and production. The new material has shown to last more than 5 million actuations with minimal wear and without degradation in spring force.

Multitest has more than seventy five mmWave contactors in the field testing automotive radar and WiGig application devices, including RF transceivers, high gain amplifiers, LNAs, filters, switches, DACs, and ADCs. The mmWave contactor utilizes hybrid contacting technology to optimize RF performance and provide robustness for production testing of the most challenging mmWave devices. Inside the mmWave contactor, RF signals and adjacent grounds are routed on a leadframe, while the rest of the DUT I/O are contacted by standard pogo pins. The number of interconnects between the DUT and tester are minimized for RF signals through the use of co-planar waveguide structures on the leadframe that make direct connection with the DUT and bypass the PCB with either a coax connector and cable or waveguide to interface directly with the tester.

Dan Campion, Director of Business Development for the Interface Products Group, comments: “We are working closely with our customers to understand their most challenging test requirements and for opportunities to continuously improve our solutions. The enhanced life time of our mmWave contactor enables  our customers to increase equipment utilization and OEE. Today customers report our mmWave contactor overall lifetime up to 1,500,000 insertions in production test with an automated handler, which is a testament to the robustness of our solution.”

To learn more about the Multitest mmWave Contactor, please visit

WLCSP Test: Efficient High Volume Solution for Post-Saw Testing

Multitest InWaferX for final test of singulated WLCSPs

Multitest’s new InWaferX final test solution for singulated WLCSPs addresses the increased quality demand for automotive applications as these quality requirements are expanding to cost sensitive, high volume consumer applications. Based on the production proven InCarrier technology, InWaferX ensures highest efficiency and yield for lowest cost of test.

The InWaferX solution enables post saw testing of singulated WLSCPs detecting all production defects in true final test of singulated devices. In addition, the same process can be deployed for retest and RMA process handling. Both options significantly enhance the production quality of the shipped devices and substantially support the zero defect parts per million (ppm) efforts of the device makers. In addition the InWaferX is equipped with a full 6 side vision inspection capability for complete physical validation.

InWaferX combines high multisite testing with the highest positioning accuracy for best yield and 100% touch efficiency on the rectangular carrier trays. InWaferX supports the high daily output requirements in today’s high volume manufacturing (HVM) environments.

Based on the well-established InCarrier / InStrip solution, the InWaferX supports full range temperature testing, as well as, MEMS/sensor testing. The InWaferX final test solution can be applied for WLSCPs from sawn film frame or tape and reel.

Andreas Bursian, Senior Director Innovation, comments: “We did extensive system validation on a production test floor and passed all requirements such as ESD, safety and operational conditions. Compared to the traditional wafer probing, the InWaferX test solution has proven to increase test throughput and outgoing device quality.

To learn more about the Multitest InWaferX solution based on the InCarrier, please visit

atg Luther & Maelzer to exhibit at Productronica 2017

Leading solutions fully automated test of bare boards

atg Luther & Maelzer will exhibit the new fully automated A8a flying probe test solution at the upcoming Productronica Show scheduled to take place November 14 – 17, 2017 in Munich, Germany.

The recently launched A8a Automatic Bare Board Flying Probe Test System provides the flexibility of flying probe test while delivering high throughput. The A8a is atg Luther & Maelzer’s latest innovation with double shuttle automation for zero product exchange time. The A8a can significantly contribute to the profitability of our customers by combining flexibility and highest test speed on a very compact foot print.

To learn more about the A8a, please visit

For additional information, meet company representatives at the show or visit

ECT’s Comprehensive Portfolio of Receptacles Offer Flexibility in PCB Test Fixture Design

ECT receptacles combine industry proven technical features with optimized cost

ECT leverages its industry leading experience in probe and receptacle design and manufacture to provide cost-effective and reliable customer-focused solutions for the most challenging ICT and FT applications. ECT receptacles allow for rapid replacement of spring probes without disrupting wiring. ECT’s comprehensive offering of receptacles provides customers with fixture design flexibility that results in an optimal product for their customers.

ECT receptacles meet both commercial and technical challenges. PCB testing requires cost effective and reliable ICT and FT receptacle solutions that allow for the replacement of spring probes in fixtures without damaging the electrical connection to the test fixture. At the same time, a stable low resistance path through the probe/receptacle assembly must be maintained while withstanding a rugged mechanical environment.

ECT replaceable probes are retained by receptacles permanently fixed into a retention plate to which electrical connection is made. Typical probe retention is achieved by detents in the receptacle or a threaded connection. Removal of the probe does not damage or break the electrical connection to the retention plate and receptacles.

Receptacles are retained in the fixture retention plate by a press fit ring on the outer surface of the receptacles. Receptacle options from ECT include:

  • Crimp receptacles (type W): This reliable connection is used primarily on smaller probe sizes in high density applications where wire wrap is not an option.
  • Solder cup (type W-1): Used to attach the wire by soldering. It offers an excellent electrical connection between wire and receptacle.
  • Wire wrapping (receptacles type W-2 and W-3): These are the preferred way of connecting wires to receptacles in higher volume fixtures as they are the least labor intensive. Wire-Wrap receptacles are available in 2 styles: square post and round post. Round post receptacles are mostly used if the connection will be made using a mating standard e.g. edge card connector.
  • Fastite® Termination: Offers the lowest fixture wiring cost for 50 mil test center receptacles. The design combines a quick wire-insertion slot in the termination end with a precision-molded dielectric sleeve that reinforces the connection, eliminates strain and prevents electrical shorting.

Learn more about the termination types here

Tony DeRosa, Senior Product Manager, comments: ”ECT provides a wide range of receptacle options that cover both size and termination selection. Our solutions ensure that our customer have an efficient way of replacing probes on PCB test fixtures, while maintaining electrical performance.”

To learn more about ECT’s portfolio of receptacles, visit

atg Luther & Maelzer to exhibit at TPCA Show 2017

Leading test solutions for bare boards and substrates

atg Luther & Maelzer will exhibit the new A8a flying probe test solution as well as, the high speed substrate test solution, S3-8, at the upcoming TPCA Show scheduled to take place October 25 – 27, 2017 at the Nangang Exhibition Center in Taipei, Taiwan.

The recently launched A8a Automatic Bare Board Flying Probe Test System provides the flexibility of flying probe test while delivering high throughput. The A8a is atg Luther & Maelzer’s latest innovation in high performance, high accuracy automatic flying probe testing. The A8a can significantly contribute to the profitability of our customers by combining flexibility with high throughput exceeding capabilities of standard flying probe tester.
To learn more about the A8a, please visit

The S3-8 10µm substrate tester meets the challenging requirements of high end substrate test, which include positioning accuracy and a high number of contact points, by applying the advanced flying probe technology of atg Luther & Maelzer. With its double-sided, eight test heads architecture the S3-8 achieves a substantially higher speed. This high throughput capability enables testing of high quantities of substrate boards using flying probe test systems providing the customer with an economical test solution.
To learn more please visit

For additional information, meet company representatives at the show or visit

ECT’s New Board Marker Probe for Reliable PCB Testing

Innovative features optimized for best performance

ECT adds the next generation board marker probe to its industry proven portfolio of ICT / FCT probes. The BMP-4 incorporates innovative and industry-leading features that result in superior performance, ease of use and maintainability.

ECT’s BMP-4 Board Maker Probe is designed for installation on bare board or loaded board test fixtures. It has been designed to combine ease-of-operation and maintainability with highest performance. The BMP-4 is easy to fixture and facilitates simple scribe tip replacement. The 10 mm diameter allows find pitch probe placement. The BMP-4 is fully adjustable in z-direction. With more than 50,000 cycles before tip replacement and a durable motor, it is the ideal solution for high volumes.

When the tester is equipped with the appropriate electronics and software, the BMP-4 scribes a permanent circle on every “passed” PCB or device tested. Boards that fail the test are not marked. The risk of human error is eliminated in PCB testing and sorting.

When activated, the spring-loaded scribe tip contacts the PCB surface. The 12 V DC motor rotates the scribe in a counter clockwise direction and leaves a .050″ (1.27 mm) circle mark onto the PCB. The probe requires less than 400″ (10 mm) of fixture area when mounted into a threaded hole. It’s designed to mark board areas comprised of bare glass (FR4), solder mask over glass, copper, or bare tinned cooper.

The probe features a full length threaded housing which allows for maximum adjustability in the Z-direction. Spare tip replacement assemblies are available.

Tony DeRosa, Senior Product Manager, comments: “This board marker probe builds on our extensive experience in providing solutions for in-circuit and functional test as well as our operational knowhow to integrate electro-mechanical assemblies. The BMP-4 adds to ECT’s industry proven board marker probe BMP-1 series”.

ECT BMP-4 board marker probes meet the need for cost efficient and highly reliable in-circuit and functional test solutions.

To learn more about the BMP-4 Board Marker Probe, please visit

Expanding MEMS Test Capabilities in the Chinese Market

Xcerra MEMS Test Cell at SITRI for Barometric Pressure Sensors

Xcerra, with its recognized industry-leading suite of flexible and cost-effective MEMS test cell offerings, announced today that SITRI, the Shanghai Industrial µTechnology Research Institute, has added barometric pressure sensor test and calibration to its test services offering. SITRI extends its MEMS test capabilities, based on an Xcerra Test Cell solution that includes an LTX-Credence Diamond tester, a Multitest InStrip handler and the Multitest InGyro, with the InBaro test module. The flexible and modular MEMS handling system of Multitest facilitates switching form one MEMS stimulus to another using the same base handler.

Whereas the InGyro module provides physical stimulation for inertial sensors, the InBaro supports environmental applications requiring barometric pressure conditions for calibration and testing of MEMS devices. Both set-ups feature a full temperature range from -40°C to +125°C.

The test cell for barometric test enables SITRI to provide multisite, cost efficient, accurate and reliable tri-temperature test for environmental sensors. The InBaro-based system supports very fast switching between various pressure levels, making it possible to efficiently test and calibrate at multiple pressure levels within a single insertion, ensuring fast test times even for comprehensive test cases. It can be upgraded to InHumid, which adds humidity and gas test capability to the barometric component, thereby supporting highly-integrated environmental sensors.

“The Xcerra test cell approach combines the advantages of a completely pre-validated one-stop solution with the flexibility of a modular set-up,” said Gabriela Born, Xcerra Director InMEMS and IoT Products “SITRI strategically leverages this feature to reconfigure the set-up to meet the requirements of new applications.”

To learn more about the Xcerra Test Cell Innovation, please visit

Multitest Successfully Introduced New Super Sharp Gemini Kelvin Probes

Seamless switch to higher-yield probes

Multitest recently passed an evaluation of new-super-sharp Gemini Kelvin (GMK) probes. The evaluation took place at an OSAT testing devices for a major customer. Although the customer was not experiencing issues with the original GMK probes, they were encouraged to try the super-sharp probes and saw a measurable improvement in both test yield and probe life. The OSAT plans to order all super-sharp probes going forward to help reduce costs and increase throughput.

As Multitest designed and fabricated finer-pitch probes over the last few years, those probes were made super sharp in order to provide adequate pressure at the contact point with the lower force developed by the smaller springs. The super-sharp probes were released to the field after the standard, rigorous internal testing. They have been in high-volume production test for several years now, and have demonstrated excellent performance.

Since then, Multitest has updated the designs of some probes to have super-sharp tips for applications where it was difficult to maintain low and consistent contact resistance (RC). The super-sharp probes exhibited the anticipated improvement in performance and continue to perform well in these applications, extending the useful life of the probes. Based on internal testing and this field data, Multitest is encouraging customers to make the seamless switch to sharp-tip styles at no increase in cost.

Senior Product Manager Bert Brost says “While the GMK product was doing a good job, we decided to make it better without any incremental cost for the customer. Making it better means increasing the customer’s throughput, increasing the customer’s system run times between cleaning, and increasing the customer’s first pass yields.”

To learn more about the Gemini Kelvin contactor, please visit

ECT Interposers for Board to Board Connections

Reliable and non-destructive connections for PCBA assemblies or testing

ECT interposers are industry-proven solutions for connecting and disconnecting boards in a reliable and non-destructive way. Drawing from its extensive portfolio of spring probes, ECT manufactures interposers that fully meet the electrical requirements of a wide variety of applications.

ECT interposers offer a high density, short profile interconnection. ECT offers an extensive catalog of spring probes to meet a range of electrical requirements including low resistance, high current, and signal integrity. These probes can then be mounted directly to a connecting board to housed in plastic, offering versatility in board to board connections, while the compliant aspect of spring probes naturally accommodates the misalignment tolerances often found in board to board interconnect applications.

ECT interposers ensure high cycle life contacts and low and stable contact resistance in a high density contact area. They connect and disconnect simply and quickly, and eliminate the need for any wired or cabled solutions.

Tone DeRosa, Senior Product Manager, comments: “With ECT’s design experience and extensive knowledge of base materials and platings, we can deliver interposers with features that completely meet customer requirements. Our interposers are perfectly suited for assemblies in communications, commercial, medical, mobile device applications and are also ideal for non-destructive board level and system level testing.”

ECT can offer interposer solutions to meet almost every need by offering application specific designs when off-the-shelf solutions will not suffice.

To learn more details about ECT’s solutions for connecting boards, please visit

LTX-Credence Ships the 600th PAx Test System for Testing RF Front End Devices

PAx and PAx-ac systems continue as the market leader for RF front end device testing

LTX-Credence shipped the 600th PAx test system to Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things. The PAx platform has been specifically designed to address the high volume manufacturing test challenges of suppliers of advanced front end RF devices such as Multiband RF Power amplifiers, RF Front End Modules, RF Analog System in Package and RF discrete devices. The PAx platform is shipped in two main configurations, PAx and PAx-ac, which are deployed at most IDM, Fabless and OSAT companies specializing in the high volume manufacturing and test of these types of devices.

“Our goal with the PAx platform was to offer semiconductor manufacturers of RF front end devices an alternative to deploying their own in house test systems.” Steve Wigley, Vice President of the semiconductor tester group of Xcerra, commented: “Our approach was to leverage LTX-Credence RF manufacturing test technology and use our systems expertise to package it in a compact footprint to offer the required levels of performance, fast test times and operational availability. The shipment of the 600th of these test systems demonstrates the value of this approach, and has established the PAx platform as the clear market leader for testing RF front end applications with an estimated market share greater than 70%”.

To learn more about the PAx test system, visit