Everett Charles Technologies introduces new member of the ZIP probes family: Z-080YHJ
Everett Charles Technologies (ECT) launched a new member of the versatile ZIP™ semiconductor test probe family. The Z-080YHJ is designed to meet the many challenges associated with testing High End Digital (HED) devices. ZIP probes are a cost effective solution that provide excellent mechanical reliability and electrical performance.
Tony DeRosa, Senior Product Manager points out: “High lead count packages require a large compression window to compensate for package co-planarity stack-up errors. In addition, these devices often require a high level of signal integrity which is typically in the 12GHz+ range. These requirements result in conflicting physical parameters. A large compression window increases the length of the probe while high bandwidth drives probe length to as short as possible.”
The Z-080YHJ’s 5.0mm test height provides a generous total compression window of 0.8mm. The probe also provides an insertion loss of 18GHz @ -1dB (GSG). These factors combined make Z-080YHJ a perfect solution for HED applications. The Z-080YHJ is scaled for 0.8mm and greater device pitches and targets high lead count BGA’s and LGA’s. The DUT side plunger is made from ECT’s durable HyperCore™ homogenous alloy. This along with its sharp dual tip geometry allows penetration of solder ball oxides with less force than standard 4-point crown tips.
ZIP probes are based on ECT’s patented, innovative flat probe technology. The manufacturing process used to fabricate ZIP probes is extremely repeatable and results in a high level of consistency from probe lot to lot. Other ZIP probes target RF, mixed signal and general purpose semiconductor test applications. Markets served include burn-in, lab testing and high volume production. Low cost and high performance are hallmarks of ZIP probes.”