3D Test Challenges and Solutions
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The presentations describes different approaches for 3D assembly and test. Existing challenges are analyzed and possible solutions are discussed. The concept of partial stack test and “Known-Good-Stack” is introduced and respective equipment requirements are summarized.
Presented at: 3D TSV Summit 2014
Presented by: Andy Nagy (Business Unit Manager InStrip & Sensors)
Date: January 2014
download the full presentation here