Leveraging ECT’s Expertise and Innovation for this Advanced PCB Test Approach
Everett Charles Technologies (ECT) has developed a series of spring probes, BTP and BPLT, specifically for bead probe test. Combining well-established design and plating principles with an innovative tip design to fully support the special requirements for contacting bead probes.
Spring probes used for bead probe test must be capable of reliable and repeatable positional accuracy to contact the hemi-ellipsoid target shape. Since bead probe structures are sensitive to contamination from solder and other materials, the test probe tip geometry must be sharp to minimize transfer. Sharp tips also allow for lower spring force probes which can increase mechanical reliability of the test fixture.
ECT has developed an innovative flat and “micro-textured” tip that is optimized for contact to the hemi-ellipsoid shape of bead probes as small as 0.004”. The textured surface is formed by closely spaced triangular pyramid shapes. This geometry ensures highly accurate contact of the typical bead probe which is long, but also small in width when placed on a PCB trace.
ECT’s BTP and BTLP probe series leverage the proprietary POGO Plus® design applying the bias ball technology to maintain an excellent internal contact between the barrel and plunger even at the low forces required for bead probe applications.
ECT’s LFRE plating, which is a proven solution for lead-free contacting based on its extreme hardness of 550 to 650 Knoop, ensures a less porous and more durable surface that is less susceptible to solder and material transfer from bead probes.
Tony DeRosa, Product Manager, explains: “With the BTP/BTLP probe series, ECT enables our PCB Test customers applying bead probe technology to significantly improve their first pass yield in high volume applications. We support this technology with OEM’s, contract manufacturers, and test fixture partners.
To learn more, visit http://ect-cpg.com/bead-target-probes