Multitest PCBs are leading the way for 0.3 mm pitch array applications
Multitest has again increased its lead over the competition for fine pitch load boards. Advancements in proprietary plating processes along with new technology in drilling and registration techniques ensure reliability, short cycle times and low cost. Multitest has responded to the needs of its customers in the very price sensitive mobile applications and vertical probe cards markets.
Fine pitch printed circuit boards are still a challenge in ATE board the industry, but Multitest leverages its expertise in single lamination high aspect PCBs to support the demands of fine pitch BGA and WLCSP applications. Based on many years of experience building high aspect ratios, Multitest deploys state-of-the-art equipment in a stable process to use mechanical drilling for 0.3mm & 0.35mm pitch via in pad constructions. PCBs with 40+ layers at .35 mm can be manufactured in a single lamination process without the use of laser drilled, “stacked”, blind vias.
Christopher Cuda, Product Manager, comments: “Using our established and continuously refined fabrication processes for 0.3 & 0.35mm geometries enables us to meet today’s requirements at reasonable cost and with the reliability customers have come to expect from Multitest.”