MT2168: Package Characterization at Cold Conditions

Leveraging the benchmark for ambient/hot test for tri-temp qualification

The Multitest MT2168 pick and place handler now offers the ability to characterize devices at cold conditions. This addresses the evolving requirements for temperature performance driven by applications in the end markets. Whereas final test of the respective devices in high volume production will only be done at ambient/hot, they need to get qualified for cold conditions before they ramp. The “Cold for Characterization” option of the MT2168 allows for using the one platform for qualification and final test without the need to invest in more complex and more expensive tri-temp test equipment.

The “Cold for Characterization” set-up of the MT2168 is an add-on to the standard base unit, which does not require changes in the handler itself. All required features are part of the conversion kit set. The customer can decide, whether he wants to use existing external chillers or if he prefers to have a LN2-based heat exchanger integrated. The “Cold for Characterization” option provides temperature conditioning directly at the contact site and sticks to the chamberless concept of the MT2168. This way no icing issues or defrost needs occur.

Günther Jeserer, Vice President for Gravity and Pick & Place Handling explains: “The MT2168 ‘Cold for Characterization’ meets the needs of the qualification teams at our customers: They can rely on the ease-of-operation of ambient/hot system but can do their full temperature characterization. With changing temperature performance requirements in the consumer markets and new car convenience and car entertainment applications in the automotive market, we anticipate a shift from strict tri-temp test in volume production to cold qualification before ramping. The MT2168 is the only handler with this ability, which is well received by our customers.”

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Cost-efficient Fine Pitch Load Boards Meet Market Needs

Multitest PCBs are leading the way for 0.3 mm pitch array applications

Multitest has again increased its lead over the competition for fine pitch load boards. Advancements in proprietary plating processes along with new technology in drilling and registration techniques ensure reliability, short cycle times and low cost. Multitest has responded to the needs of its customers in the very price sensitive mobile applications and vertical probe cards markets.

Fine pitch printed circuit boards are still a challenge in ATE board the industry, but Multitest leverages its expertise in single lamination high aspect PCBs to support the demands of fine pitch BGA and WLCSP applications. Based on many years of experience building high aspect ratios, Multitest deploys state-of-the-art equipment in a stable process to use mechanical drilling for 0.3mm & 0.35mm pitch via in pad constructions. PCBs with 40+ layers at .35 mm can be manufactured in a single lamination process without the use of laser drilled, “stacked”, blind vias.

Christopher Cuda, Product Manager, comments: “Using our established and continuously refined fabrication processes for 0.3 & 0.35mm geometries enables us to meet today’s requirements at reasonable cost and with the reliability customers have come to expect from Multitest.”


Strip Test for Automotive Applications

European IDM selected Multitest InStrip for high parallel test in automotive production

Multitest InStrip® test handler has been already well-established at a number of different customers in Asia, Europe and US. Recently, Multitest received a multiple order from European IDM that will leverage the high-parallel test capability for standard SOCs for the automotive market.

In the past strip test was considered not be appropriate for applications with high quality requirements – such as automotive or medical – because singulation of the packages would have to take place after testing. Multitest‘s InCarrier concept overcomes these issues and combines the substantial advantages of the strip handling process with the quality driven advantages of the standard test handling process. “Although the automotive market is driven by high quality requirements, reduced cost of test will give our customers a competitive advantage. High parallel strip test will substantially increase their test efficiency”, explains Peter Killermann, product manager.

The Multitest InStrip is known for production proven performance in tri-temp strip test of standard ICs and MEMS. Leading contacting technology, outstanding temperature performance, ease of use as well as greatest flexibility make the InStrip® the optimal solution for high volume final test. Advanced device tracking features as well as factory automation options like recipe management and remote system control support the high quality demands of the automotive users.

“High temperature performance and tri-temp capability is a standard requirement in the automotive market segment. The Multitest InStrip particularly convinced with the proven temperature accuracy and stability for the entire carrier”, concludes Killermann.

Learn more about Multitest strip test solutions