Meeting the Challenges of Cost-Efficient Testing High-End Digital Devices

Everett Charles Technologies introduces new member of the ZIP probes family: Z-080YHJ

Everett Charles Technologies (ECT) launched a new member of the versatile ZIP™ semiconductor test probe family. The Z-080YHJ is designed to meet the many challenges associated with testing High End Digital (HED) devices. ZIP probes are a cost effective solution that provide excellent mechanical reliability and electrical performance.

Tony DeRosa, Senior Product Manager points out: “High lead count packages require a large compression window to compensate for package co-planarity stack-up errors. In addition, these devices often require a high level of signal integrity which is typically in the 12GHz+ range. These requirements result in conflicting physical parameters. A large compression window increases the length of the probe while high bandwidth drives probe length to as short as possible.”

The Z-080YHJ’s 5.0mm test height provides a generous total compression window of 0.8mm. The probe also provides an insertion loss of 18GHz @ -1dB (GSG). These factors combined make Z-080YHJ a perfect solution for HED applications. The Z-080YHJ is scaled for 0.8mm and greater device pitches and targets high lead count BGA’s and LGA’s. The DUT side plunger is made from ECT’s durable HyperCore™ homogenous alloy. This along with its sharp dual tip geometry allows penetration of solder ball oxides with less force than standard 4-point crown tips.

ZIP probes are based on ECT’s patented, innovative flat probe technology. The manufacturing process used to fabricate ZIP probes is extremely repeatable and results in a high level of consistency from probe lot to lot. Other ZIP probes target RF, mixed signal and general purpose semiconductor test applications. Markets served include burn-in, lab testing and high volume production. Low cost and high performance are hallmarks of ZIP probes.”

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Reliable Probes for Most Challenging High Current Testing

Everett Charles Technologies Introduces HC500F High Current Probe

Everett Charles Technologies (ECT) introduces the latest addition to our versatile family of high current probes; the HC500F. The HC500F is rated at 150 Amps DC and is designed for the most challenging applications in a broad range of industrial test applications including transportation, automotive, power grid, military and PCB test.

The HC500 enhances the ECT high current spring probe line. The extensive ECT high current probe offering now comprises 8 different continuous current ratings – starting at 10 Amps and peaking at 150 Amps. All ECT high current probes are optimized to meet the dedicated needs of high current applications. Tip styles have been developed to maximize surface contact and reduce arcing. Body geometries and materials have been defined to minimize resistance. ECT high current probes ensure reliable and repeatable testing up to 150 Amps and support extended test times.

Tony DeRosa, Product Manager confirms:”Our probes are designed to address the critical parameters of high current testing: low resistance plungers, optimized base materials and plating, high temperature spring design, and high current tip geometry. Building on ECT’s experience in probe design and fabrication, we’re able to offer these rugged and reliable solutions for high volume production and engineering characterization testing.”

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ECT’s Launches New Probe Family for RF Signal Testing of PCBAs and Industrial Applications

CSP-40 significantly reduces cost per insertion with best best electrical performance at competitive pricing

Everett Charles Technologies (ECT) recently launched a new line of high frequency test probes for the PCBA and industrial test markets. The
CSP-40 high frequency probe family offers high reliability and excellent electrical performance at competitive pricing and significantly reduces the cost per test insertion.

Designed in ECT’s proven coaxial architecture the CSP-40 probe provides an instrumentation-quality 50 ohm impedance interface for broadband RF measurements up to 6 GHz. The physical and electrical characteristics are precisely controlled to ensure accurate and repeatable results. The RF center conductor system is captivated for maximum reliability.

The open architecture probe format accommodates a wide range of physical circuit topologies and alleviates the need for special geometry contact pads on the circuit under test. The CSP-40 line is offered in standard plunge-to-board configurations, which are off-the-shelf. It can also be customized to meet specific contact pattern requirements. The CSP-40 probe can also be configured to mate with industry standard connectors such as SMP, SMA, SMB and others. These RF probes can also serve as an ideal port-extending accessory for network analyzers and time domain reflectometers.

Tony DeRosa, Senior Product Manager confirms: “ECT probes are an ideal choice for high volume as well as engineering characterization applications. The new CSP-40 probe family leverages Xcerra’s extensive experience in providing solutions for signal integrity sensitive applications. We have over 10 years of simulating complex test structures including probes, PBCA’s and launches. We build and test many structures to validate our products and corresponding models.”

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ECT’s ZIP™ Probe for Semiconductor Test Exceeds Customer Expectations

ZIP probes built from HyperCore™ base material proved superior performance in high volume production

Everett Charles Technologies (ECT) successfully passed a two month evaluation of ZIP probes using the HyperCore material option in a high volume production environment at a large OSAT in Singapore. The ZIP probe exceeded the critical first pass yield expectations and beat the target for a 500 k insertions life time by over 20%.

ZIP is one of several semiconductor test probe families offered by ECT. For this evaluation the ZIP probe was deployed in a quad-site test set-up for a 250 BGA package with 0.8 mm pitch for an Ethernet/MoCA (Multimedia over Coax Alliance) end application. The test was done at ambient and hot (85°C) conditions.

ECT’s patented ZIP probes feature a number of innovative design attributes that provide superior contact capability. ZIP probes have a large internal contact area resulting in low contact resistance, superior bandwidth and excellent conductance. ZIP probes built from HyperCore present a new level of accuracy, scalability and performance. The proprietary non-plated, homogenous probe material possesses properties that prevent oxidation, ensuring premium performance throughout high volume production cycles. With 600 Knoop hardness, it is inert to common wear related to contacting tough surfaces and abrasive cleaning.

Tony DeRosa, Senior Product Manager explains: “Customers are continuously requiring lower cost per insertion. ECT’s ZIP™ probes meet this challenge by bringing value to customers through competitive pricing, high reliability and excellent electrical performance. Last summer ECT released the HyperCore material option to the entire ZIP product line. HyperCore adds an advanced material option to expand the cost of test advantage.”

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Meeting the Requirements of Lead Free PCBA Testing

Everett Charles Technologies Enhances LFRE Product Line: Lead Free Long Travel Probes (LFLT)

Everett Charles Technologies (ECT) extended the probe offering (LFRE probes) for lead free PCB in-circuit and functional test applications to include long-travel probes (LFLT probes). ECT LFLT probes have almost twice the compliance as standard length probes. The new long-travel probes meet the need for reliable contact solutions for lead free dual-stage in-circuit test fixtures.

Long-travel probes are coated with ECT‘s proprietary hard plating alloy called LFRE. LFRE plating has a hardness of about 600 Knoop which is approximately 5 times harder than Gold plating. In addition to improved tip wear, LFRE plated probes are less prone to solder transfer.

ECT now offers the proprietary hard plating on long-travel probes often used in dual stage fixture applications. The new LFLT probe line is offered in three pitches 50, 75 and 100mil (1.27, 1.91 and 2.56mm) and a variety of tip styles.

LFLT probes combine ECT‘s knowledge in materials and platings with probe fabrication know-how along with advanced probe design capabilities such as ECT‘s proven PogoPlus® bias-ball design and double roll-close process. LFLT probes leverage this expertise to achieve a sustainable and reliable contact to a variety of PCB targets.

Tony DeRosa, Product Manager explains: “Lead free solder typically has a harder and stickier solder flux and oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder resin and oxides can also increase debris transfer to spring probes.  ECT’s LFRE plated probes have demonstrated the ability to penetrate the hard resin and oxide layer without premature wear and solder accumulation. LFRE plating is the best solution to contact to RoHS compliant board as well as OSP (Organic Solder Paste) boards.

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Reliable Probes for Most Challenging High Current Testing

Everett Charles Technologies Introduces H375 High Current Probes

Everett Charles Technologies (ECT) introduces the latest addition to our versatile family of high current probes; the HC375. The HC375 is rated at 100 Amps DC and is designed for the most challenging applications in a broad range of industrial test including transportation, automotive, power grid, military and PCB test.

The HC375 enhances the ECT high current spring probe line. The extensive ECT high current probe offering now comprises six different continuous current ratings – starting at 10 Amps and peaking at 100 Amps. All ECT high current probes are optimized to meet the dedicated needs of high current applications. Tip styles have been developed to reduce arcing. Body geometries and materials have been defined to minimize resistance. ECT high current probes ensure reliable and repeatable testing up to 100 Amps and support extended test times.

Tony DeRosa, Product Manager confirms: “Our probes cover the critical factors of high current testing: low resistance plungers, optimized base materials and plating, high temperature spring design, and high current tip geometry. Building on ECT´s experience in probe designing and machining, we are able to offer these rugged and reliable solutions for high volume production and engineering characterization testing.”

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ECT Improving Performance and Reliability for PCBA Test and Industrial Applications

Everett Charles Technologies Launches l40 Tip Style

Everett Charles Technologies (ECT) launches the new l40 tip style. The innovative geometry of the l40 tip ensures best yield and reliability and overcomes the challenges of contacting lead free solder or OSP treated copper.

Lead free solder and OSP treated copper present a harder or more abrasive contact surface causing excessive plating and probe tip wear. The l40‘s advanced off axis tip geometry machining methodology was designed to improve tip wear and resistance to tip fracturing. l40 tip style offers a more robust probe design and a longer tip life. The l40‘s straight shaft lance with a 40° facet combines the penetration capability of a sharp tip probe while providing added material behind the tip to increase strength.

l40 tip style is available for probes that meet the toughest challenges in PCBA test and industrial test while providing superior performance and reliability.

The development of the l40 tip style combined the thorough understanding of the needs in the PCBA test and industrial test markets with leading in-house design and manufacturing capabilitites.

The l40 tip style is featured on ECT‘s Metrix, LFRE and LFTL probe series.

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ECT Launches Versatile RF Probes Semiconductor Test

Z1 and Z0 Probes leverages ECT‘s flat technology to achieve the next level performance

Everett Charles Technologies (ECT) launches two new members of the ZIP™ probe family designed to meet signal integrity challenges driven by the ever increasing speed of semiconductors devices. Z0 and Z1 probes are a cost effective solution that provide excellent mechanical reliability and electrical performance.

Tony DeRosa, Senior Product Manager points out: “While conventional round probe technology restricts travel and only allows for a small internal contact area, ZIP™ based on ECT’s flat technology offers generous travel and a large contact area. The result is excellent electrical performance for the critical parameters of bandwidth, contact resistance and current capacity. The manufacturing processes used to fabrication ZIP™ probes are extremely repeatable and stable ensuring probe to probe consistency. We have over four decades of spring probe engineering experience. Our patented, innovative flat probe technology optimized electrical and mechanical performance. ECT offers ZIP in two high performance versions: Z1 and Z0”.

Z1 is ECT’s high bandwidth series with a test height of 2.7 mm. It offers an insertion loss of approximately 30 Ghz at -1 dB. Z0 is ECT’s ultra-high bandwidth series. Z0’s short test height of 1.5 mm and 0.60 nH of inductance provides an insertion loss of 40 Ghz at -1 dB. The probes are available for semiconductor packages with a pitch down to 0.4 mm and are applicable for a wide range of RF testing of applications from lab and characterization to burn-in to high volume final test.

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Everett Charles Technologies Releases HyperCore™ Material to Full ZIP™ Probe Product Line

Premium Performance for Semiconductor Test Based on Superior Probe Material

Everett Charles Technologies (ECT) releases the HyperCore™ material to the full ZIP™ product line. ZIP™ is an ECT single probe family that is dedicated to semiconductor test applications. HyperCore™ is an innovative, non-plated and homogenous probe material optimized for longer probe life, longer cleaning cycles and reliable contact.

HyperCore™ leverages ECT’s extensive knowledge of contact materials. This proprietary material possesses properties that prevent oxidation, ensuring premium performance throughput high volume production cycles. With its 600 Knoop hardness, HyperCore™ is inert to common wear related to contacting tough surfaces and abrasive cleaning.

Tony DeRosa, Senior Product Manager explains: “ECT’s ZIP™ probes architecture features an innovative design that provide for superior contact capability. All ZIP™ products have a large internal contact area resulting in low resistance, superior bandwidth and excellent conductance. HyperCore™ adds an advanced material option to expand the cost of test technology. HyerCore™ ZIP™ probes present a new level of accuracy, scalability and performance in high volume semiconductor test.”

HyperCore™ is available as material option for all ZIP™ probes.

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Everett Charles Technologies Expands Line of Battery Probes

CP-2 probe family combines best volume production qualities and cost with design flexibility and fast prototype

Everett Charles Technologies (ECT) recently launched the next generation of Battery Interconnect Probes. The versatile CP-2 probe family is highly flexible and designed to match any performance, cost and assembly requirements.

CP-2 probes support many charging and docking applications at a better cost point than other similar products. The CP-2 family is modular and supersedes time-consuming re-designs for customization. Probe options include several lengths and mounting options including a right angle solution. Therefore selecting the appropriate length of the pin, pressing it into plastics or attaching it to a PWB is easy. The CP-2 probes can be configured to fully meet the requirements of OEM projects. The CP-2 probe family combines best volume production qualities and pricing with wide design flexibility and quick turn prototyping.

Tony DeRosa, Product Manager, comments: “We understand the need of our customers for widest design flexibility and rapid prototyping as well as cost pressures in volume manufacturing. With our design expertise and complete manufacturing capabilities we can help bring competitive products to market faster.”

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