Efficient Testing of Environmental Sensors

Multitest InBaro will expand test capacity at a European IDM

Multitest’s InBaro test module for barometric sensors continues to expand its footprint in the growing MEMS and sensor market. The Multitest InBaro was recently shipped on a repeat order to a major European semiconductor manufacturer expanding the capacity for testing barometric sensors. The increasing volumes associated with these types of sensors are driven mainly by consumer applications used to monitor their environment or aid in indoor navigation. The Multitest InBaro delivers a high return on investment because it offers the greatest flexibility and supports the most cost-efficient test and calibration, which is particularly important to meet the requirements of this fast-growing market.

InBaro is part of Multitest’s broad portfolio of InMEMS modules that work in combination with Multitest’s proven InStrip handler. It is designed according to Multitest’s modular concept for MEMS test and calibration, facilitating system conversion to other MEMS/sensor test applications, e.g. for gyroscope or microphone test. InBaro offers a high degree of flexibility. It can be upgraded to InHumid, which adds humidity and gas test capability to the barometric component thereby supporting highly-integrated environmental sensors.

InBaro-based systems are designed to switch very fast between various pressure levels. Therefore it is possible to efficiently test and calibrate the sensors at multiple pressure levels within a single insertion, ensuring fast test times even for comprehensive test cases.

The InBaro can be used in a Multitest InCarrier set up to support reliable and robust test handling of small MEMS packages, which are typical for environmental sensors in consumer applications.

Garbiela Born, Director InMEMS and IoT Products, comments: “We are proud of this repeat order. It confirms that the system meets the expectations of the customer. In addition to the small package handling capability, cost-efficiency and flexibility, which all are key performance factors of the players competing in this end market, the customer particularly recognized the temperature accuracy of the system.”

To learn more about the Multitest sensor test portfolio, please visit http://multitest.com/sensor

Ensuring Temperature Accuracy for Testing of High Pin Count Packages

Multitest MT2168 Pick-and-Place Handler offers advanced temperature control features

The Multitest MT2168 pick-and-place handler now offers an optional active socket purge (ASP). The ASP completes the portfolio of advanced temperature control features of the MT2168, which include Active Temperature Control (ATC), Cold Test for Characterization on the ambient / hot base handler version and now the ASP.

The ASP keeps the temperature contact pin in the socket on the set test temperature by applying a thermal controlled air flow to the pins. Particularly for high pin count devices this has significant influence on the overall temperature performance and reduces the temperature calibration efforts. The ASP can be configured with up to 16 independent sets of temperature sensor, controller and heater to ensure best temperature accuracy for each device under test.

Günther Jeserer, VP Gravity and Pick & Place Products, explains: “We continue to develop advanced features for the MT2168 to expand the capabilities of this leading pick and place handler. To achieve the advanced temperature performance we leveraged the more than 25 years of expertise within the Company and a wide range of production proven developments. All new features of the MT2168 will be available on the new MT2168 XT handler ambient/hot/cold test, which will be officially released later this year.”

To learn more about the Multitest MT2168, please visit http://multitest.com/mt2168

MicroLink: Miniaturization of Link Technology for Small Pitches and Advanced Electrical Requirements

Multitest leverages the innovative and field proven Link technology to develop MicroLink – a probe which addresses advanced electrical test requirements for lower inductance and better signal integrity.

The MicroLink probe offers enhanced performance in all major electrical categories: impedance, insertion loss, inductance, contact resistance, and signal integrity. The signal path has been shortened to 0.373 mm. MicroLink supports RF applications with 60GHz and higher.

Mechanically the MicroLink probe features optimized contact wipe and pointing accuracy, which makes it most appropriate for packages with a pitch down to 0.3 mm.

Tony Tiengtum, Product Managers, confirms: “MicroLink is a field proven re-design of the well-established Link technology, which allows our customers to leverage the benefits of the Link technology for applications with even stricter electrical requirements and/or smaller device pitches. Our customers, which have been deploying MicroLink in production for several months, report that the MicroLink proves superior electrical performance over competitor’s solutions. ”

To learn more, download the MicroLink Fact Sheet: MicroLink FactSheet

MacroLink: Making Link Technology Footprint Compatible to Existing Set-Ups

Multitest offers the field proven Link technology as a replacement option for existing solutions. MacroLink combines full foot print compatibility with production proven electrical and mechanical performance.

MacroLink particularly addresses board wear issues, which customer faced with competitor’s solutions. The MacroLink facilitates the replacement by keeping full compatibility to existing test handler conversion kits and load boards.

For MacroLink the Link probe design has been adjusted to comply with larger offset footprints. Additionally, the probe geometry has been optimized for electrical performance.

Tony Tiengtum, Product Managers, explains: “MacroLink was driven by customers request to replace competitor’s solutions, which caused substantial board wear issues. The design of MacroLink makes it an easy drop-in alternative.”

To learn more, download the MacroLink Fact Sheet: MacroLink Fact Sheet

Link Contactor Family: Offset Vertical Probe with Wipe Design for Best Mechanical and Electrical Performance

Multitest’s Link Contactor family line for analog, mixed signal, and RF applications applies innovative vertical probe design. Link Contactors combine advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads.

The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The wipe motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pad, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arching between the probe and the test interface board pad.

The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in different styles optimizing the solution to the requirements of the specific test applications.

To learn more about the Multitest Link Contactor family, visit www.multitest.com/Link

Gaining A Competitive Advantage by Leveraging Xcerra Test Cell Integration

Xcerra to deliver a fully integrated and validated test cell for pressure sensor test

Xcerra provide a complete test cell to a major IDM in the automotive semiconductor market. The complete test cell solution includes the tester, handler, tester interface and the sensor test module from Xcerra, and a pressure supply unit from a third party. In addition to the hardware, Xcerra will develop the test program and provide full integration and validation services.

The Xcerra test cell will combine the high-throughput capability of the Multitest InMEMS/InCarrier solution with the cost-efficient LTX-Credence Diamondx tester. The solution will also include the integration of a third party pressure supply unit. With this Xcerra solution the customer will receive a fully integrated and validated test cell for pressure sensor calibration, trim and test, providing fast time-to-volume and optimal OEE and yield.

Andreas Nagy, Senior Director, Test Cell Innovation, comments, “With the fully integrated and validated Xcerra Test Cell the customer will benefit from high operational efficiency and an accelerated time to high volume production on day one. The high throughput solution will be able to contact 90 devices in parallel resulting in a significant cost of test advantage.”

To learn more about the Xcerra Test Cell Innovation, please visit www.Xcerra.com/TCI

 

 

Multitest Introduces mmWave Contactor

Revolutionary interface for high frequency testing in high volume production

Multitest successfully introduced an innovative contacting solution for testing of extremely high frequency semiconductors in high volume production. The Multitest mmWave Contactor offers field proven outstanding electrical performance while maintaining best mechanical characteristics.

Multitest has developed a revolutionary hybrid contacting solution that combines traditional spring probe architecture for low frequency and power I/O’s while incorporating a cantilever solution for the peripheral high frequency transceiver I/O’s. By combining spring probe and cantilever technologies Multitest has extended the reach of volume production contactors to the extremely high frequencies ranges needed by automotive radar, WiGig, and 5G backhaul devices.

Keeping the interface from test equipment to the device as short as possible while minimizing the number of transitions is how Multitest is able to minimize the loss and maintain broadband performance from DC to 81GHz (<-10dB return loss and 4dB to 6dB insertion loss typical at 81GHz).

The mmWave contactor addresses the mechanical requirements of high volume production by incorporating high compliance, robust spring probes and materials and onsite replacement compatibility. The contactor assembly can be fully serviced onsite without incurring delays due to shipping lead times or RMA queues. The entire contacting solution is mechanically assembled and each component can be removed and replaced on site.

The mmWave contactor solution from Xcerra is a field proven solution for high volume semiconductor test that has overcome the challenge of using of metal transmission lines for extremely high frequency applications..

Jason Mroczkowski, Director RF Product Development and Marketing explains: “With the advent of production volumes of extremely high frequency semiconductors, it begs the question, ‘How will you test it?’. The experts at Multitest have considered all factors ranging from impedance discontinuities to stackup tolerances and their impact on RF performance at mmWave frequencies. Xcerra is the only supplier offering a complete test cell solution for volume production of automotive radar devices up to 81GHz. This test cell includes the tester, handler, and interface components required for a true high volume production test of mmWave devices. A critical component of this hardware is the Multitest mmWave Contactor. To date there are many lab and low volume solutions for extremely high frequency semiconductor test, but none exist for true high volume production test of mmWave devices. Until now.”

Multitest Expands Contactor Portfolio for WLP / WLCSP Testing:

Mercury 030 combines best mechanical and electrical performance with ease of use and cost advantages 

Multitest’s Mercury 030 probe meets the increasing demand for cost-efficient high performance WLP / WLCSP contacting solutions. The Mercury 030 is designed to address the electrical requirements of today’s test challenges, without sacrificing mechanical performance in an automated test environment. The Mercury 030 is a WLCSP fine pitch probe made using a Multitest proprietary process that produces a long life, high strength probe with gold plating. For high reliability, stability, and very low contact resistance contacting, the Mercury 030 has two flat surfaces moving in surface-to-surface contact.

While electrical and cost benefits are turning WLP and WLCSP into the “go-to” packaging of choice, traditional wafer probe technology can prevent customers from testing the device in a WLP package to published specification. The low RLC parasitics of the Mercury 030 make it a preferred contacting solution for customers who want to fully test wafer level packaged devices in the DC, functional, and AC parametric domains.

The Mercury 030 probe geometry and components provide high bandpass (8 GHz @-1 dB insertion loss) and low resistance (160 mΩ). The Mercury 030 ensures required probing coplanarity matching the vertical heights of the customers’ WLCSP balls and/or lands. With a 0.33 mm window of compliance and low insertion force, the Mercury 030 is well qualified for both singulated and multisite WLP and WLCSP contacting and/or probing.

During customer field tests, the Mercury 030 demonstrated long run times between cleaning with an average probe replacement life of 300K -500K device contacts.

Particularly valued in a high volume environment, the Mercury 030 is easy to setup and to maintain.

Bert Brost, Product Manager at Xcerra’s Interface Product Group explains: “Although the Mercury 030 can cost less than traditional probe technology, its ease of use, ease of maintenance, and high performance attributes directly address customer test requirements. With this new contacting solution we are supporting our customers’ efforts to reduce costs and improve throughput. The Mercury 030 is the result of Multitest spring probe development experience, integrating proven technology that is of greater value to the customer than products offered by the competition.”

To learn more about the Multitest Mercury family, please visit www.multitest.com/Mercury

 

Most Flexible MEMS/ Sensor Test and Calibration Equipment for Best RoI

Multitest offers efficient solutions for a wide range of applications

Multitest MEMS test equipment is based on a modular design, which combines well established handling equipment with state-of-the-art test and calibration modules dedicated to the specific application. This approach offers proven benefits for the test quality and the return on investment.

Multitest’s portfolio includes solutions based on strip test as well solutions, which leverage the capabilities of the standard gravity or pick-and-place handling systems for up to 8 parallel test sites. All systems cover the full ambient-hot-cold temperature range. Whereas the strip test systems provide best cost of test for high volumes, smaller to medium production volumes benefit from the lower investment requirements for gravity and pick-and-place based systems.

The handling systems for singulated test are combined with “MEMS” cart, which houses the exchangeable MEMS stimulus box, which is designed according to the dedicated customer requirements. This way highest flexibility is ensured: By exchanging the stimulus box the MEMS cart can be converted for different MEMS applications. By undocking the MEMS cart from the test handler, the handler is ready for standard IC test. This offers the opportunity to first calibrate the MEMS part of the device and then perform the final electrical test on the same equipment.

Multitest offers a comprehensive portfolio of MEMS test solutions based on gravity and pick-and-place handlers including high g accelerometers (up to 100 g), low g or gyroscopes up to 6 degrees of freedom, magnetometer with rotating stimulus or Helmholtz coils and pressure test applications.

Andy Ludwig, Product Mangers comments: “Leveraging our knowledge from handling equipment with an installed base of more than 3,500 and our experience in MEMS/sensor test and calibration equipment of more than 15 years, we are able to offer high quality solutions to our customers, which combine proven standard solutions with custom tailored modules in the most efficient way.”

To learn more about Multitest MEMS and sensor test and calibration equipment for singulated devices , please visit http://multitest.com/s-mems/

 

Bringing MEMS Testing to the Next Level

Installation of first complete Xcerra turn key test cell for MEMS in Asia

Xcerra finalized the installation of a complete test cell for 3/6DOF inertial and navigation MEMS applications at an Asian customer. The test cell leverages proven Xcerra expertise in highly parallel test of sensor devices, delivered through the LTX-Credence and Multitest semiconductor test brands. The customer benefits from the pre-validated test cell set-up, with integrated test program and optimization support, to rapidly realize outstanding test efficiency and target yield performance.
The Xcerra MEMS test cell ideally combines the cost of test advantages of highly-parallel, high-throughput testing with the flexibility of the scalable base equipment. The Multitest InStrip handler with the exchangeable InFlipM MEMS stimulus and interface options and high-density Mercury contactors is combined with the Diamondx tester using DPIN96 digital pins; this combination supports the fast test and calibration of 3DOF magnetometers at 204 sites in parallel on strip, as well as 2/3DOF accelerometers at 216 sites in parallel, using the Multitest InCarrier solution for wafer level package test at about 1.5×1.5 mm device size. Changing between the applications requires less than 30 minutes to swap the test interfaces, the handler conversion kit and the test program.

Peter Cockburn, Senior Product Manager Test Cell Innovation, explains: “The project was driven by an Asian fabless customer, who searched for a highly parallel test solution at an OSAT to support the aggressive production ramp and cost of test reduction goals for his mobility MEMS applications. With the Xcerra Test Cell Solution, the fabless customer is now able to outsource his test in a highly efficient way. In addition, the OSAT can fully leverage the flexibility of the Xcerra Test Cell Solution for further business opportunities.”

To learn more about the Xcerra Test Cell Innovation, please visit www.Xcerra.com/TCI