Entries by Daniela

MT2168: Package Characterization at Cold Conditions

Leveraging the benchmark for ambient/hot test for tri-temp qualification The Multitest MT2168 pick and place handler now offers the ability to characterize devices at cold conditions. This addresses the evolving requirements for temperature performance driven by applications in the end markets. Whereas final test of the respective devices in high volume production will only be […]

ECT Improving Performance and Reliability for PCBA Test and Industrial Applications

Everett Charles Technologies Launches l40 Tip Style Everett Charles Technologies (ECT) launches the new l40 tip style. The innovative geometry of the l40 tip ensures best yield and reliability and overcomes the challenges of contacting lead free solder or OSP treated copper. Lead free solder and OSP treated copper present a harder or more abrasive […]

atg Luther & Maelzer to exhibit at TPCA Show 2014

Leading Bare Board PCB Test Solutions – Testing the Limits atg Luther & Maelzer will exhibit its leading PCB test solutions at the upcoming TPCA show, scheduled to take place October 22-24, 2014 at the Nangang Exhibition Center Taipei, Taiwan. At the show, atg Luther & Maelzer will showcase the latest product of their industry […]

ECT Launches Versatile RF Probes Semiconductor Test

Z1 and Z0 Probes leverages ECT‘s flat technology to achieve the next level performance Everett Charles Technologies (ECT) launches two new members of the ZIP™ probe family designed to meet signal integrity challenges driven by the ever increasing speed of semiconductors devices. Z0 and Z1 probes are a cost effective solution that provide excellent mechanical […]

Xcerra™ to present at Semicon Europa 2014

The new brand in the electronics supply chain dedicated to your success Xcerra Corporation announces that Peter Cockburn, Senior Product Manager of Test Cell Innovation, will give a presentation at the upcoming Semicon Europa trade show, scheduled to take place October 7-9 in Grenoble, France. Peter will present “Using a Test-Cell-Solution Approach to Achieve Device […]

Everett Charles Technologies Releases HyperCore™ Material to Full ZIP™ Probe Product Line

Premium Performance for Semiconductor Test Based on Superior Probe Material Everett Charles Technologies (ECT) releases the HyperCore™ material to the full ZIP™ product line. ZIP™ is an ECT single probe family that is dedicated to semiconductor test applications. HyperCore™ is an innovative, non-plated and homogenous probe material optimized for longer probe life, longer cleaning cycles […]

Cost-efficient Fine Pitch Load Boards Meet Market Needs

Multitest PCBs are leading the way for 0.3 mm pitch array applications Multitest has again increased its lead over the competition for fine pitch load boards. Advancements in proprietary plating processes along with new technology in drilling and registration techniques ensure reliability, short cycle times and low cost. Multitest has responded to the needs of […]

Strip Test for Automotive Applications

European IDM selected Multitest InStrip for high parallel test in automotive production Multitest InStrip® test handler has been already well-established at a number of different customers in Asia, Europe and US. Recently, Multitest received a multiple order from European IDM that will leverage the high-parallel test capability for standard SOCs for the automotive market. In […]

Everett Charles Technologies Expands Line of Battery Probes

CP-2 probe family combines best volume production qualities and cost with design flexibility and fast prototype Everett Charles Technologies (ECT) recently launched the next generation of Battery Interconnect Probes. The versatile CP-2 probe family is highly flexible and designed to match any performance, cost and assembly requirements. CP-2 probes support many charging and docking applications […]

“Seeking Growth” the topic of the panel discussion at Semicon West:

Xcerra Meets Current Trends in the Semiconductor Business with a Most Comprehensive Approach The semiconductor test and packaging industry segment is being driven by adoption of increased integration, advanced packaging, and adaptive test. Well-balanced and innovative strategies will be needed to ensure further productivity gains at the semiconductor manufacturers. Equipment suppliers have to reconsider both […]