MicroLink: Miniaturization of Link Technology for Small Pitches and Advanced Electrical Requirements

Multitest leverages the innovative and field proven Link technology to develop MicroLink – a probe which addresses advanced electrical test requirements for lower inductance and better signal integrity.

The MicroLink probe offers enhanced performance in all major electrical categories: impedance, insertion loss, inductance, contact resistance, and signal integrity. The signal path has been shortened to 0.373 mm. MicroLink supports RF applications with 60GHz and higher.

Mechanically the MicroLink probe features optimized contact wipe and pointing accuracy, which makes it most appropriate for packages with a pitch down to 0.3 mm.

Tony Tiengtum, Product Managers, confirms: “MicroLink is a field proven re-design of the well-established Link technology, which allows our customers to leverage the benefits of the Link technology for applications with even stricter electrical requirements and/or smaller device pitches. Our customers, which have been deploying MicroLink in production for several months, report that the MicroLink proves superior electrical performance over competitor’s solutions. ”

To learn more, download the MicroLink Fact Sheet: MicroLink FactSheet