Multitest’s Link Contactor family line for analog, mixed signal, and RF applications applies innovative vertical probe design. Link Contactors combine advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads.
The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The wipe motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pad, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arching between the probe and the test interface board pad.
The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in different styles optimizing the solution to the requirements of the specific test applications.
To learn more about the Multitest Link Contactor family, visit www.multitest.com/Link