IEEE European Test Symposium
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Date: Tuesday, May 24
Time: 4:30 – 6:00 pm
Session 3B: Vendor – Mixed-Signal and RF Test
“ATPG tool for Automotive and Mixed Signal Test”
Speaker: Frans Mosselveld (Xcerra Corporation), Piet-Jan Kromwijk (NXP)
An ATPG tool has been developed to improve productivity for automotive and mixed signal customers developing test programs using the Unison ATE programming environment. Input on feature requirements from users has helped to optimize the usefulness of the tool.
When developing mixed signal test programs, users are often pressured by time constraints to write monolithic sections of code that are poorly documented and difficult to maintain. Graphical “block structured” interfaces in commercial ATE are often perceived to slow-down the process of generating a test program and may be bypassed, losing the potential benefits of these structured templates and integrated graphical debug tools.
The ATPG tool helps to bridge the gap between fast program generation and use of structured graphical tools. It creates the complete infrastructure of a C++ test program from a small number of simple spreadsheet files and incorporates an extensive set of library classes and tools to simplify coding and debugging. By enforcing a clear program structure, it helps the user create a test program that can be easily maintained and extended. Full documentation of the complete test program is also automatically created using doxygen.
Date: Thursday, May 26
Time: 2:00 – 3:30 pm
Session 8A: Special Session on IoT: Source of Test Challenges (PLENARY)
“Testing Challenges for IoT Smart Sensors”
Speaker: Peter Cockburn
According to many market predictions, the IoT will drive a “third wave” of semiconductor growth to enable over 25 billion sensors by 2020 for end-node applications in multiple market segments . These IoT end nodes are smart, connected ‘things’ that typically consist of 3 key elements: sensors, microcontrollers (including flash memory) and low-power wireless interfaces.
Fig.1. IoT end nodes: ‘Connected Smart Things’
This functional integration, combined with the need to perform final test and calibration of different kinds of sensor nodes, is creating a multi-dimensional test challenge in manufacturing. This discussion will review aspects of the different test challenges and propose solutions to answer them in a cost effective way.
IoT Sensor Trends
The Internet of Things (IoT) is the network of physical objects that contain embedded technology to communicate and sense or interact with their internal states or the external environment .
In recent years, many sensor types migrated from larger, analog architectures into semiconductor (MEMS) implementations, enabling several factors of miniaturization and resulting cost reduction. This high level of sensor integration has supported the smartphone revolution, delivered new levels of automotive performance and enabled many other new applications.