Combining Leading Temperature Performance with Highest Flexibility for Pick and Place Handling

Multitest has shipped the first MT2168 XT for ambient/hot/cold applications

Multitest shipped the first MT2168 XT tri-temp pick and place handler to a major IDM. The MT2168 XT combines the innovative architecture of the MT2168 ambient/hot handler with leading temperature test performance, for which Multitest has been known for decades. The MT2168 XT offers greatest flexibility and best performance for highest return on investment and lowest cost of test.

It leverages more than 30 years of experience in test handling and the technology leadership in temperature test. The MT2168 XT provides a reliable test handling solution for the complete range of packages, which are usually provided in trays, at ambient, ambient/hot and ambient/hot/cold temperature conditions.

The innovative architecture and material flow offers significant advantages in throughput, stability and reliability, as well as, floor space requirements and conversion kit cost.

A wide range of options allow for extending the capabilities of the MT2168 XT in the field according to actual needs. The site pitch kit supports a fully flexible contact site layout to comply with the design of existing load boards. Sophisticated plunging solutions ensure best first pass yield in high volume production.

Günther Jeserer, Vice President Gravity and Pick & Place Products, comments: “Even before the public launch of this new pick and place handler, we received multiple orders from our customers, which see the unique advantage of this highly modular and scalable tri-temp handler. The MT2168 XT leverages both, the innovative design of our MT2168 platform and the more than 30 years of Multitest’s experience in test handling – particularly in temperature testing. It provides a state-of-the-art test handling solution for today’s applications and is well equipped to meet future requirements.”

To learn more about the MT2168 XT tri-temp pick and place handler, please visit http://multitest.com/mt2168-xt

High Volume Testing of Fingerprint Sensors with Multitest InStrip

Major OSAT deploys Multitests solution for an application of one of the worlds leading fingerprint sensor companies

Multitest’s InStrip has been selected to be the platform of a set up for high parallel testing of fingerprint sensors in China. The solution relies on Multitest’s well established and production proven InStrip / InCarrier, which is extended to fingerprint testing by a dedicated conversion kit (CK).

Andreas Bursian, Director InStrip & InMEMS Products, explains: “Fingerprint sensing technology has been considered to be one of the most reliable and cost effective biometrics technologies. Currently, we see a rapid growth in the demand for fingerprint sensors mostly driven by uses in consumer applications and smart homes but also for governmental and industrial security. The market is expecting to experience a double digit growth rate in the coming five years. This requires high volume proven test solutions. With testing up to 90 devices in parallel, Multitest offers a unique solution, which exceeds the parallel test capability of alternative (wafer probing) solution significantly.”

To learn more about Multitest’s MEMS test solution for high parallel testing, please visit multitest.com/InMEMS

Multitest Introduces ACE Contactor:

Cost-efficient contactor solution for best RF performance

Multitest recently introduces the ACE Contactor, which offer optimal RF performance for fine pitch FBGA, QFN and wafer-level packages at an attractive. Typical applications for this new contactor are Power Amplifiers, RF switches and mobile communications.

The ACE probe has a revolutionary, which provides exceptional electrical performance, both DC and RF. The ACE probe is manufactured from HyperCore™ base material, which is a proprietary material of Xcerra’s ECT Contact Product Group. HyperCore™ combines the mechanical properties of high carbon steel, with the electrical properties of BeCu and non-oxidizing properties of a precious metal.

The materials and architecture create a very robust probe with a very working life and best yield. The electrical and mechanical performance, combined with the long probe life, deliver low overall cost of test, which are unprecedented for RF contactors.

Within the range of applications the ACE probe are compatible with all device types, platings, and pitches; and all test applications, including singulated devices, strip test and wafer-scale test. The ACE contactor supports pitches down to 0.4 mm.

Jason Mroczkowski, Director RF Product Development and Marketing explains: “ACE contactor has been evaluated by initial customers, which report significant improvements compared to other solutions: More than double the probe life and substantially better figures for current consumption, gain, standard deviation, and power efficiency.”

To learn more about the Multitest ACE Contactor, please visit http://multitest.com/ace

High Performance Probe for Lead-Free Fine Pitch PCBA Test Applications

Everett Charles Technologies launches LFRE-39 probe

Everett Charles Technologies (ECT) introduces the LFRE-39 spring probe to complete its comprehensive portfolio of products for lead-free test applications.  LFRE-39 features ECT’s LFRE™ plating and is designed to meet fine pitch requirements down to 39 mil (1.0 mm). The LFRE-39 fully meets the demanding requirements of high volume production in-circuit and functional test.

LFRE plated probes are field proven to provide enhanced performance in high volume production test environments. LFRE probes are less prone to solder transfer and tip wear due to their exceptional hardness. Lead free solder and OSP (Organic Solderability Preservatives) treated copper pads typically present a harder or more abrasive contact surface causing excessive plating and probe tip wear. Customers report that LFRE plating has demonstrated longer life and MTBM (mean time between maintenance) on their most challenging applications. LFRE plating is significantly harder than typical gold plating. LFRE has a hardness range of 550 to 650 Knoop which is about 3 to 4 times harder than standard gold. This makes the probe tips more durable and less susceptible to solder and material transfer. LFRE plated probes are the best solution to contact RoHS compliant boards and OSP boards.

Lead free plating is featured on ECT’s industry standard PogoPlus® LFRE series, Metrix™, and on LFLT Long Travel probes.  With the addition of LFRE-39, ECT’s proprietary plating is now available on a wide range of pitch options.

Tony DeRosa, Product Manager, explains: “In head to head testing with traditional gold plated probes, LFRE plated probes offer lower and more consistent resistance. LFRE probes have also outperformed gold plated probes in high volume production test applications by 3 to 5% first pass yield improvement. With LFRE-39 we can provide a reliable test probe solution for fine pitch lead-free PCBA test fixture applications.

To learn more about the ECT In-circuit nd Functional Test Probes, visit http://ect-cpg.com/ICT-FCT-probes

ChipMOS Selects Xcerra’s Test Cell Solution to Support High Volume MEMS Device Testing

ChipMOS purchases multiple integrated test cells for Shanghai factory

After evaluating several alternatives ChipMOS has selected Xcerra’s total test cell solution as their preferred test platform for high volume production of MEMS devices at its Shanghai facility. ChipMOS is an industry leading provider of semiconductor assembly and test services with factories in Hsinchu and Southern Taiwan Science Parks in Taiwan and Shanghai. ChipMOS is now well prepared to support further MEMS fabless and IDM customers’ mobility, automotive and IOT volume production requirements for MEMS calibration and test in Shanghai.

The Xcerra MEMS test cell incorporates the cost-efficient LTX-Credence Diamondx tester and the high throughput Multitest InMEMS/InCarrier solution. ChipMOS chose the Xcerra test cell solution because it combines Diamondx’s high parallel test capability with Multitest’s advanced package handling and MEMS stimulus options. The fully integrated solution delivers a pre-validated test cell directly to ChipMOS’s manufacturing floor minimizing the time to high volume production. The initial cells are equipped to switch between high multisite testing of 3DOF magnetometer devices on a strip or 3DOF and 2DOF accelerometer devices in a carrier.

With the Xcerra MEMS test cell, ChipMOS and their fabless customers fully benefit from the Xcerra expertise in test cell integration – including tester-handler communication, test interface design, as well as, MEMS stimulus integration. The high test cell throughput results in a significant cost of test reduction. Even with the integration the test setup retains a high degree of flexibility for ChipMOS to reconfigure the test cell for other applications and sensor types.

S.J. Cheng, Chairman and CEO of ChipMOS, comments, “As a leading provider of semiconductor assembly and test services we continuously strive to optimize our equipment so we can offer our customers the highest quality and throughput, at the best price. The Xcerra MEMS test cell enables us to achieve these goals today for 6DOF accelerometer and magnetometer test. Due to the flexibility of the Xcerra MEMS test cell, we are able to efficiently expand our MEMS test capabilities at any times for pressure, barometric or humidity sensors and MEMS microphones. The option to test devices on strip or in carrier allows us to reliably handle wafer level packages.”

Andreas Nagy, Senior Director TCI, adds: “We understand that the OSAT business requires highest flexibility and the ability to adjust to new customer applications and order volumes rapidly. With the Xcerra test cell offering, we are able to provide leading technical solutions, which combine the benefits of system level integration with the wide flexibility to reconfigure the setup fast.”

To learn more about the Xcerra Test Cell Innovation, please visit http://xcerra.com/tci