Professional Test Fixture Maintenance Ensures Premium Performance

Everett Charles Technologies offers Test Fixture Maintenance Guide

Everett Charles Technologies’ (ECT) offers a detailed maintenance guide for both ICT and FCT fixtures and probes, which provides best practice techniques and processes. Maintaining the test fixture at optimum levels ensures the best test performance.

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MicroLink: Miniaturization of Link Technology for Small Pitches and Advanced Electrical Requirements

Multitest leverages the innovative and field proven Link technology to develop MicroLink – a probe which addresses advanced electrical test requirements for lower inductance and better signal integrity.

The MicroLink probe offers enhanced performance in all major electrical categories: impedance, insertion loss, inductance, contact resistance, and signal integrity. The signal path has been shortened to 0.373 mm. MicroLink supports RF applications with 60GHz and higher.

Mechanically the MicroLink probe features optimized contact wipe and pointing accuracy, which makes it most appropriate for packages with a pitch down to 0.3 mm.

Tony Tiengtum, Product Managers, confirms: “MicroLink is a field proven re-design of the well-established Link technology, which allows our customers to leverage the benefits of the Link technology for applications with even stricter electrical requirements and/or smaller device pitches. Our customers, which have been deploying MicroLink in production for several months, report that the MicroLink proves superior electrical performance over competitor’s solutions. ”

To learn more, download the MicroLink Fact Sheet: MicroLink FactSheet

MacroLink: Making Link Technology Footprint Compatible to Existing Set-Ups

Multitest offers the field proven Link technology as a replacement option for existing solutions. MacroLink combines full foot print compatibility with production proven electrical and mechanical performance.

MacroLink particularly addresses board wear issues, which customer faced with competitor’s solutions. The MacroLink facilitates the replacement by keeping full compatibility to existing test handler conversion kits and load boards.

For MacroLink the Link probe design has been adjusted to comply with larger offset footprints. Additionally, the probe geometry has been optimized for electrical performance.

Tony Tiengtum, Product Managers, explains: “MacroLink was driven by customers request to replace competitor’s solutions, which caused substantial board wear issues. The design of MacroLink makes it an easy drop-in alternative.”

To learn more, download the MacroLink Fact Sheet: MacroLink Fact Sheet

Link Contactor Family: Offset Vertical Probe with Wipe Design for Best Mechanical and Electrical Performance

Multitest’s Link Contactor family line for analog, mixed signal, and RF applications applies innovative vertical probe design. Link Contactors combine advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads.

The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The wipe motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pad, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arching between the probe and the test interface board pad.

The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in different styles optimizing the solution to the requirements of the specific test applications.

To learn more about the Multitest Link Contactor family, visit www.multitest.com/Link

ECT’s ZIP™ Z0 RF Spring Probe for Semiconductor Test Exceeds Customer Expectations

ZIP probes built from HyperCore™ base material provides superior performance in high volume production

Everett Charles Technologies (ECT) successfully won a head-to-head evaluation of ZIP probes with the HyperCore™ material option in a high volume production environment at a large Chinese OSAT. The Z0 probes reached 450k insertions more than doubling the life of the competitor’s spring probe while exceeding first pass yield expectations.

ZIP is one of several semiconductor test probe families offered by ECT. For this evaluation the ZIP Z0-040RHJ probe was deployed in a multi-site test set-up for a 14L, 0.4mm pitch QFN package. The application was a RF transceiver. Testing was performed at ambient and hot (85°C) conditions. With its 1.5mm test height Z0 is an excellent choice for RF devices requiring low insertion loss (40GHz @ -1dB) and low inductance (0.55nH).

ECT’s patented ZIP probes feature a number of innovative design features that provide superior contact capability. ZIP probes have a large internal contact area resulting in low contact resistance, superior bandwidth and excellent conductance. ZIP probes are built from HyperCore™ and present a new level of accuracy, scalability and performance. The proprietary non-plated, homogenous probe material possesses properties that prevent oxidation, ensuring premium performance throughout high volume production cycles. With a hardness rating of 600 Knoop; ZIP has excellent wear characteristics, is effective for contacting hard DUT surfaces and withstands abrasive cleaning.

Tony DeRosa, Senior Product Manager explains: “Customers are continuously requiring lower cost per insertion. ECT’s ZIP™ probes meet this challenge by bringing value to customers through competitive pricing, high reliability and excellent electrical performance. Our RF simulation and validation capabilities further expands the cost-of-test advantage by providing a high level of confidence that Z0 will meet or exceed critical RF test requirements.”

To learn more about ZIP™ please visit ect-cpg.com/semiconductor-probes

NEW Double Sided Flying Probe Tester for Substrate Test from atg Luther & Maelzer

S3-8 Double Sided High Speed Substrate Tester with 8 Test Heads for Structures Down to 10 µm             

atg Luther & Maelzer has added a double sided flying probe system for substrate test to its line of flying probe testers. The S3-8 10 µm substrate tester is the latest model of a new atg Luther & Maelzer product line launched last year with the introduction of the single sided S3. The single sided S3 and the double sided S3-8 both meet the challenging requirements of high end substrate test such as positioning accuracy and high number of contact points by applying the advanced flying probe technology of atg Luther & Maelzer.

Substrates are used to enable a connection between a semiconductor and a printed circuit board. A typical test panel consists of about 50 to 100 single substrates and has a size of approximately 250 mm x 80 mm. Each substrate has about 1000 to 2000 test points  requiring about 100,000 pads being contacted to achieve 100% continuity and isolation testing. For testing substrates on semiconductor side, structures as small as 10 µm have to be reliably contacted.

To meet this challenge the S3-8 utilizes eight freely moveable test heads and achieves a test rate of 100 ohmic two-point measurements per second. Optionally the test system can be fitted with a vacuum table for a capacitance based test.

Prior to electrical test, an optical alignment of the test sample correlates the shrinkage and offset of the finished product with the testing data and adjusts automatically. Two 5 Megapixel color cameras with a resolution of 1.2 µm ensure positioning accuracy of +/- 1.5 µ. The S3 systems work with a micro needle with a contacting pressure that is programmable from 0.3 g up to 2.5 g to ensure best test yield and repeatability without damaging the contact pads. The maximum test area of the substrate tester S3-8 is 350 mm x 310 mm (13.8” x 12.2”).

Jochen Kleinertz, vice president PCB Test Group at Xcerra explains: “Today’s established test systems are mostly single sided and therefore do not allow 100% ohmic continuity tests. However, more and more customers are asking for this type of test. The expertise of atg Luther & Maelzer in double sided test systems together with the unique multi head technology makes outstanding accuracy, speed and throughput possible.

We expect that this high throughput capability will enable double sided testing of substrate boards with flying probe test systems despite the high test point counts. This will allow our customers to use new test options for high end substrate boards, which were not available in the past.”

To learn more about the S3-8 Double Sided High Speed Substrate Tester, please visit http://atg-lm.com/S3-8 .