High Performance Spring Probes for In-circuit and Functional PCBA Test

ECT’s EDGE probe combines leading architecture and materials for lead free applications

Everett Charles Technologies’ (ECT) EDGE probes are the answer to poor first pass yield, short probe life and excessive cleaning cycles, when caused by oxide layer build up or debris, particularly in lead free applications. In volume manufacturing the impact worsens as cycle count increases and elevated levels of debris are transferred to the probe tips.  In many applications effective electrical contact is compromised.

Lead free solder is known to cause many problems during in-circuit testing. Lead free solder has a higher reflow temperature, which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder resin and oxides can also increase debris transfer to spring probes.

ECT’s EDGE probes meet these challenges as well as those found in OSP (organic solderability preservatives) and no-clean applications by combining innovative probe design with the ultra-hard plating material – ECT’s proprietary LFRE hard plating. LFRE plating is significantly harder than the industry’s standard gold plating. LFRE has a hardness range of 550 to 650 Knoop.  LFRE improves tip performance while helping maintain tip sharpness.

EDGE probes feature an ultra sharp tip geometry that is capable of penetrating debris, oxide and OSP layers. The tip radius is 0.0003” and is about 10 times sharper than typical machined probe tips. Additionally, EDGE probes apply ECT’s proven Micro-Wipe bias technique that provides low and consistent internal contact resistance.

Tony DeRosa, Product Manager, explains: “Recently ECT has enhanced key processes related to probe assembly. The results are a more consistent set of mechanical parameters and electrical performance. In addition, the spring design has changed to reduce stress and increase life. EDGE tip geometries have also been optimized to make sustainable, reliable contact to PCB targets such as vias. EDGE is ECT’s answer to your most challenging test contact applications. It combines design, materials and platings expertise along with probe fabrication knowledge.”

For more Information about the ECT In-circuit and Functional Test Probes, please visit: http://ect-cpg.com/ICT-FCT-probes

 

atg Luther & Maelzer to exhibit at International Printed Circuit & APEX South China Fair, in Shenzhen

High Precision Flying Probe Test and Production Proven Grid Test Equipment

atg Luther & Maelzer will exhibit its leading test solutions for PCBs and substrates at the upcoming International Printed Circuit & APEX South China Fair scheduled to take place December 2-4, 2015 at the Shenzhen Convention & Exhibition Center, China.

atg Luther & Maelzer will showcase its well established grid test solutions LM2010 combined with the proven optical alignment system “Sniper” for the test of motherboards with pads sizes down to 150 µm.

From the leading flying probe product family, atg Luther & Maelzer will exhibit the recently launched S3 Tester. The S3 Flying Probe tester is capable to contact 10µm Substrate and meets all challenging requirements of high end substrate test. Such as positioning accuracy and high number of contact points by applying the advanced flying probe technology of atg Luther & Maelzer.

For more information, meet company representatives at the show or visit www.atg-LM.com.

 

 

Most Flexible MEMS/ Sensor Test and Calibration Equipment for Best RoI

Multitest offers efficient solutions for a wide range of applications

Multitest MEMS test equipment is based on a modular design, which combines well established handling equipment with state-of-the-art test and calibration modules dedicated to the specific application. This approach offers proven benefits for the test quality and the return on investment.

Multitest’s portfolio includes solutions based on strip test as well solutions, which leverage the capabilities of the standard gravity or pick-and-place handling systems for up to 8 parallel test sites. All systems cover the full ambient-hot-cold temperature range. Whereas the strip test systems provide best cost of test for high volumes, smaller to medium production volumes benefit from the lower investment requirements for gravity and pick-and-place based systems.

The handling systems for singulated test are combined with “MEMS” cart, which houses the exchangeable MEMS stimulus box, which is designed according to the dedicated customer requirements. This way highest flexibility is ensured: By exchanging the stimulus box the MEMS cart can be converted for different MEMS applications. By undocking the MEMS cart from the test handler, the handler is ready for standard IC test. This offers the opportunity to first calibrate the MEMS part of the device and then perform the final electrical test on the same equipment.

Multitest offers a comprehensive portfolio of MEMS test solutions based on gravity and pick-and-place handlers including high g accelerometers (up to 100 g), low g or gyroscopes up to 6 degrees of freedom, magnetometer with rotating stimulus or Helmholtz coils and pressure test applications.

Andy Ludwig, Product Mangers comments: “Leveraging our knowledge from handling equipment with an installed base of more than 3,500 and our experience in MEMS/sensor test and calibration equipment of more than 15 years, we are able to offer high quality solutions to our customers, which combine proven standard solutions with custom tailored modules in the most efficient way.”

To learn more about Multitest MEMS and sensor test and calibration equipment for singulated devices , please visit http://multitest.com/s-mems/

 

Everett Charles Technologies to exhibit at BIOMEDevice Show 2015

Leading Connector Solutions Meeting Challenging Requirements

Everett Charles Technologies (ECT) will exhibit its leading Compliant Connector Solutions at the upcoming BIOMEDevice Show scheduled to take place December 2 -3, 2015 at the San Jose Exhibition Center, California.

ECT offers a comprehensive portfolio of compliant connectors including customized solutions. ECT’s “standard connectors” are based on a highly flexible architecture, which facilitates cost-efficient configurations for customer requirements. ECT compliant connectors meet the highest quality standards and have proven superior durability in high life cycle applications.

Leveraging decades of experience and a US-based manufacturing, ECT uses application specific materials and contact technology to ensure reliable signal integrity. ECT Compliant Connectors feature sealed connections and are also available for high current and high frequency applications.

ECT continuously strives to offer the best solutions for challenging applications. Recently, ECT launched the Accordion™ probe. Accordion™ is a patented contact technology from ECT that targets high reliability applications. It’s well suited for demanding environments found in medical markets. Accordion spring contacts incorporate a compliant, one-piece spring in an open architecture format to accommodate a wide range of physical circuit topologies. Utilizing a single contact eliminates the threat of liquid and debris build up between parts while also being tolerant of vibration and shock. Accordion offers several surface contact advantages over traditional compliant contacts. One of which is placing multiple contacts per position to allow for single target redundancy.

It can also be designed to provide a controlled scrub which removes oxides and debris from the contact position and its mate. The Accordion scrubbing action ensures surface contact, while the single beam prevents the momentary resistance spikes found in connection systems requiring a wide range of actuation. This versatile contact can be tailored to specific x-y-z envelops and compression force targets.

For more information, please visit: http://ect-cpg.com/compliant-connector or http://ect-cpg.com/accordion