Conversion Kit Design Makes a Difference

Multitest launches local kit design team in the Philippines

Multitest makes a significant step to expand customer support. Starting May 2015 an additional design team for conversion kits will be supporting the needs of Asian customers. The local design team based in the Philippines will be the expert contact for kit related requests of customers and ensure shortest response times.

Efficient handling solutions are often based on appropriate design of the conversion kits. Customers will be able to explain their requirements directly to the designers and  will receive immediate feedback on the available design options. Understanding the conditions of each alternative provides a better basis for decision making.

Based in the close location to the customer the design kit team will be able to get clarification on open issues fast and efficiently. The overall cycle time from kit order to delivery can be substantially shortened.

Syariffuddin A. Kamarudin, Product Manager, explains: “Kit business is important for our customers and for us. Often the overall handling solution is based on innovative kit design. We are proud to offer this additional support to our customer base in Asia. We staffed the team with experienced designers. Our goal is to establish another channel for technical discussion with our customers. The designers will work with customers onsite. A thorough understanding of the customer requirements will enable them to translate it directly into a design concept.”

ECT’s Launches New Probe Family for RF Signal Testing of PCBAs and Industrial Applications

CSP-40 significantly reduces cost per insertion with best best electrical performance at competitive pricing

Everett Charles Technologies (ECT) recently launched a new line of high frequency test probes for the PCBA and industrial test markets. The
CSP-40 high frequency probe family offers high reliability and excellent electrical performance at competitive pricing and significantly reduces the cost per test insertion.

Designed in ECT’s proven coaxial architecture the CSP-40 probe provides an instrumentation-quality 50 ohm impedance interface for broadband RF measurements up to 6 GHz. The physical and electrical characteristics are precisely controlled to ensure accurate and repeatable results. The RF center conductor system is captivated for maximum reliability.

The open architecture probe format accommodates a wide range of physical circuit topologies and alleviates the need for special geometry contact pads on the circuit under test. The CSP-40 line is offered in standard plunge-to-board configurations, which are off-the-shelf. It can also be customized to meet specific contact pattern requirements. The CSP-40 probe can also be configured to mate with industry standard connectors such as SMP, SMA, SMB and others. These RF probes can also serve as an ideal port-extending accessory for network analyzers and time domain reflectometers.

Tony DeRosa, Senior Product Manager confirms: “ECT probes are an ideal choice for high volume as well as engineering characterization applications. The new CSP-40 probe family leverages Xcerra’s extensive experience in providing solutions for signal integrity sensitive applications. We have over 10 years of simulating complex test structures including probes, PBCA’s and launches. We build and test many structures to validate our products and corresponding models.”

Read more about High Frequency Probes

Combining Flexibility and Throughput Improvements for Sensor Test

Multitest has shipped first 45° high g sensor test module for kitable MT9928 gravity handler

Multitest shipped the first “Shaker” 45° high g sensor test module for the MT9928 to a major international IDM. The module allows for a two axis testing with one single stimulation on a flexible and modular handler platform. The well-established “Shaker” module, which was originally available for the MT93xx only, is now also available for the flexible and modular MT9928 gravity handler.

The MT9928 has a kitable and modular architecture and therefore can be converted to different package types and configured with various loading and unloading options. The generic Multitest MEMS test approach deploys all features and functions of the standard handling system and meets the MEMS specific requirements by adding MEMS/sensor test and calibration carts with dedicated stimulus boxes.

The new 45° high g sensor test solution fully continues this approach. The 45° high g sensor is dedicated for X/Y stimulation of the MEMS devices and allows for two axis testing in one single stimulation. This way one stimulation cycle time can be saved and the packages need to be touched less often, which reduces the risk of damages during test. If testing has to be done at various temperature levels this advantage multiplies.

The new 45° high g module for the MT9928 gravity handler combines test time and test process optimization with more flexibility and better equipment utilization.

To learn more about Multitest’s MEMS test and calibration solutions, please visit www.multitest.com/sensor

ECT’s ZIP™ Probe for Semiconductor Test Exceeds Customer Expectations

ZIP probes built from HyperCore™ base material proved superior performance in high volume production

Everett Charles Technologies (ECT) successfully passed a two month evaluation of ZIP probes using the HyperCore material option in a high volume production environment at a large OSAT in Singapore. The ZIP probe exceeded the critical first pass yield expectations and beat the target for a 500 k insertions life time by over 20%.

ZIP is one of several semiconductor test probe families offered by ECT. For this evaluation the ZIP probe was deployed in a quad-site test set-up for a 250 BGA package with 0.8 mm pitch for an Ethernet/MoCA (Multimedia over Coax Alliance) end application. The test was done at ambient and hot (85°C) conditions.

ECT’s patented ZIP probes feature a number of innovative design attributes that provide superior contact capability. ZIP probes have a large internal contact area resulting in low contact resistance, superior bandwidth and excellent conductance. ZIP probes built from HyperCore present a new level of accuracy, scalability and performance. The proprietary non-plated, homogenous probe material possesses properties that prevent oxidation, ensuring premium performance throughout high volume production cycles. With 600 Knoop hardness, it is inert to common wear related to contacting tough surfaces and abrasive cleaning.

Tony DeRosa, Senior Product Manager explains: “Customers are continuously requiring lower cost per insertion. ECT’s ZIP™ probes meet this challenge by bringing value to customers through competitive pricing, high reliability and excellent electrical performance. Last summer ECT released the HyperCore material option to the entire ZIP product line. HyperCore adds an advanced material option to expand the cost of test advantage.”

Read more about Semiconductor Probes