Offset Vertical Probe with Scrub Design for Best Test Yield and Lowest Cost of Test

Multitest Adds Link Contactor to Its Interface Products Portfolio

Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.

The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pads, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arcing between the probe and the test interface board pad.

The Link probe offers a bandwidth of 60 GHz @ -1 dB. The short signal path minimizes distortion and makes testing with a Link comparable to solder board device testing.

The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in three different styles – Link HD, Link EC and MicroLink – optimizing the solution to the requirements of the specific test applications.

Tim McNulty, Vice President of the Xcerra Interface Products Group comments: “Titan Semiconductor Tools has developed a unique contactor technology that fits in perfectly with our overall strategy of offering customers best-in-class testers, handlers, interface boards and contactors, as well as, combining those products into total test cell solutions. The Link technology overcomes the mechanical, wear and maintenance issues associated with competitive solutions for the target market of high speed applications.”

Learn more about Link Contactor

atg Luther & Maelzer Launches Flying Probe Tester for Substrates

S3 High Speed Substrate Tester for Structures Down to 10 µm

atg Luther & Maelzer has delivered the first flying probe system for substrate test to a major customer in Korea. The S3 10 µm Substrate Tester is the first system of a new atg Luther & Maelzer product line. It meets the challenging requirements of high end substrate test such as positioning accuracy and high number of contact points by applying the advanced flying probe technology of atg Luther & Maelzer.

Substrates are used to enable a connection between a semiconductor and a printed circuit board. A characteristic test panel consists of about 50 – 100 single substrates and has a size of approx. 250 mm x 80 mm. For electrical testing it is necessary to contact all end points of the product. Each substrate has about 1000 – 2000 test points. So on one product about 100,000 pads need to be contacted. For testing substrates on the semiconductor side, structure down to 10µm have to be reliably contacted.

To meet this challenge the S3 deploys four freely moveable test heads and achieves a test rate of 100 measurements per second. The test heads contact the test product from above and execute a capacitance measurement against a vacuum table. The capacitance result indicates opens and shorts in the substrates.

Prior to electrical test, an optical alignment of the test sample correlates the shrinkage and offset of the finished product with the testing data and adjusts automatically. A 5 Megapixel color camera with a resolution of 1.2 µm ensures positioning accuracy of +/- 1.5 µ.

The S3 works with a micro needle. The contacting pressure of this micro needle can be adjusted from 0.3 g up to 2.5 g to ensure best test yield and repeatability without damaging the contact pads. The maximum test area of the substrate tester S3 is 310 mm x 300 mm (12.2” x 11.8”).

Jochen Kleinertz, vice president PCB Test Group at Xcerra explains: “Today’s established systems work with two test heads and achieve test rates of around 30 measurements per second. With its four test heads architecture the S3 achieves more than three times this speed. We expect that this high throughput capability will enable testing of higher quantities of substrate boards with flying probe test systems in the future. This will provide the customer with an economical test solution for high end substrate boards. After the successful market introduction of the single-sided S3 we plan to complete our new product line with a double-sided system with eight test heads.”

Multitest Adds Link Contactors to Its Interface Products Portfolio

Offset Vertical Probe with Scrub Design for Best Yield and Lowest Cost of Test

Multitest has launched the new Link Contactor product line for analog, mixed signal, and RF applications. The innovative vertical probe design combines advantageous mechanical features – such as self-cleaning and scrub – with superior electrical performance and an architecture that eliminates wear on test interface board pads. The Link contactor is based on the technology developed by Titan Semiconductor Tools acquired by Xcerra Corporation in February.

The offset vertical architecture of the Link probe is designed to support superior test yield, maximum repeatability and low repair and replacement cost. The motion of the probe provides scrub through oxides on the IC pads and cleans itself when moving back to its original free height. This motion is fully decoupled from the connection to the test interface board resulting in a stable connection between the probe and the load board pad, avoiding pad wear and carbon debris buildup. This implementation also eliminates the potential for arching between the probe and the test interface board pad.

The Link probe offers a bandwidth of 60 GHz @ -1 dB. The short signal path minimizes distortion and makes testing with a Link comparable to solder board device testing.

The footprint compatibility of the Link contactor supports easy replacement of existing solutions. The Link probe is available in three different styles – Link HD, Link EC and MicroLink – optimizing the solution to the requirements of the specific test applications.

Tim McNulty, Vice President of the Xcerra Interface Product Group comments: “Titan Semiconductor Tools has developed a unique contactor technology that fits in perfectly with our overall strategy of offering customers best-in-class testers, handlers, interface boards and contactors, as well as, combining those products into total test cell solutions. The Link technology overcomes the mechanical, wear and maintenance issues associated with competitive solutions for the target market of high speed applications.”

Learn more about Link Contactor

InCarrier plus Dedicated to High Volume Production

Multitest launches the next generation loader for test in carriers

Multitest is launching the first InCarrierplus with the shipment to a major IDM with high volume production in Europe and Asia. The InCarrierplus is the new state-of-the art loading solution for test in carriers. It is designed to optimize the back-end process at high volume production sites. The InCarrierplus supports the device loading to carrier from standard back-end transport media in a most cost-efficient and productivity-oriented way.

Since Multitest introduced the InCarrier concept to leverage the advantages of strip handling for singulated packages, this process has been well-accepted in the market. Up to now more than 3 billion packages were tested on InCarrier set-ups. The customers fully benefit from the robust, high parallel test solution. The advantages are particularly recognized for large production lots, long test times and/or small packages.

The InCarrierplus is minimizing cost of loading and increases throughput  up to 16,000 units per hour depending on packages sizes. The InCarrierplus has been optimized for smaller footprint and requires less space on the test floor. The InCarrierplus is supporting standard back-end transport media – such as JEDEC trays and bulk – and can be smoothly integrated in state-of-the-art production flows and lines. On the test floor the InCarrierplus / InStrip solution can be combined with standard final packaging equipment for tape & reel, tube or tray output and fits therefore seamless into the production process.

Andreas Nagy, Senior Director Marketing commented: “Multitest was the first supplier to who actually offered the test in carrier solution – the first Multitest InCarrier Loader/Unloader was launched as a dedicated loading and unloading tool. The InCarrierplus leads this concept to the next level of overall productivity improvement. This gets achieved by significant loading cost reduction at the InCarrierplus and the elimination of the unloading cost by direct un-load into tape & reel at traditional final packaging equipment for high volume production”

Learn more about InCarrierplus

New Flying Probe PCB Tester for Large Format, High Layer-Count

Backplanes: atg Luther & Maelzer releases the A7-20

atg Luther & Maelzer a company of Xcerra Corporation, announces the release and the first installations of the new A7-20 flying probe test system. Specifically designed for the demands of large format, high layer count backplanes, the A7-20 combines the flexibility typical for flying probe testers with accuracy and speed. The A7-20 significantly reduces test time and test cost.

The market segment for the A7-20 are large server and back panel designs for the telecommunication industry. These kinds of designs have up to 72 layers with a product weight of up to 30 kg (66 Ibs). 100.000 test points are very common on formats of up to 1.25 m (50 inches). In combination with higher density electrical test comes challenging. Traditional test solutions such as four-head probe systems or multiple oversized test fixtures for grid systems cannot fully meet the requirements in terms of speed and cost.

The new A7-20 flying probe system is equipped with 20 test heads, 10 cameras for optical alignment and the latest motion system design with direct linear drive technology for highest accuracy and test speed even on large format.

The A7-20 is designed to fully support ease-of-operation and best operator/machine ratio. The horizontal test position provides the advantage that one operator is able to load and unload these heavy printed circuit boards. A moveable support table, which can be attached to the front of the system, is available for loading and unloading.

The most comprehensive configuration of the A7 oversized system product line is an A7-24 with 24 test heads and 12 cameras for the optical alignment. A maximum board size up to 1.50 m (60 inches) can be tested at best volume production conditions.

Jochen Kleinertz, VP PCB Test Group at Xcerra comments: “We recently delivered and commissioned the first two systems in two large format PCB fabricators in China. With these new flying probe systems, we enable our customers to efficiently meet the increasing demand for high test coverage and 4-wire testing (Kelvin test) also for large PCBs. The unique and industry leading architecture of the atg Luther & Maelzer flying probe product line makes it possible to use a higher number of flying probes per test area and by this to bring down time and cost of test.”