ECT Improving Performance and Reliability for PCBA Test and Industrial Applications

Everett Charles Technologies Launches l40 Tip Style

Everett Charles Technologies (ECT) launches the new l40 tip style. The innovative geometry of the l40 tip ensures best yield and reliability and overcomes the challenges of contacting lead free solder or OSP treated copper.

Lead free solder and OSP treated copper present a harder or more abrasive contact surface causing excessive plating and probe tip wear. The l40‘s advanced off axis tip geometry machining methodology was designed to improve tip wear and resistance to tip fracturing. l40 tip style offers a more robust probe design and a longer tip life. The l40‘s straight shaft lance with a 40° facet combines the penetration capability of a sharp tip probe while providing added material behind the tip to increase strength.

l40 tip style is available for probes that meet the toughest challenges in PCBA test and industrial test while providing superior performance and reliability.

The development of the l40 tip style combined the thorough understanding of the needs in the PCBA test and industrial test markets with leading in-house design and manufacturing capabilitites.

The l40 tip style is featured on ECT‘s Metrix, LFRE and LFTL probe series.

Read more about ICT / FCT Probes

atg Luther & Maelzer to exhibit at TPCA Show 2014

Leading Bare Board PCB Test Solutions – Testing the Limits

atg Luther & Maelzer will exhibit its leading PCB test solutions at the upcoming TPCA show, scheduled to take place October 22-24, 2014 at the Nangang Exhibition Center Taipei, Taiwan.

At the show, atg Luther & Maelzer will showcase the latest product of their industry leading flying probe product line: A8-8 Flying Probe Tester

The A8-8 is the fastest flying probe tester in its class. Eight test heads, fast Kelvin test and four high resolution color cameras ensure fast and highly accurate test. The A8-8 features direct linear drives with carbon z-axis, to support quick and stable movements. The A8-8 is the leading edge test solution for all kinds of bare boards.

For more information, meet company representatives at the show or visit http://www.atg-lm.com/atglm.nsf

ECT Launches Versatile RF Probes Semiconductor Test

Z1 and Z0 Probes leverages ECT‘s flat technology to achieve the next level performance

Everett Charles Technologies (ECT) launches two new members of the ZIP™ probe family designed to meet signal integrity challenges driven by the ever increasing speed of semiconductors devices. Z0 and Z1 probes are a cost effective solution that provide excellent mechanical reliability and electrical performance.

Tony DeRosa, Senior Product Manager points out: “While conventional round probe technology restricts travel and only allows for a small internal contact area, ZIP™ based on ECT’s flat technology offers generous travel and a large contact area. The result is excellent electrical performance for the critical parameters of bandwidth, contact resistance and current capacity. The manufacturing processes used to fabrication ZIP™ probes are extremely repeatable and stable ensuring probe to probe consistency. We have over four decades of spring probe engineering experience. Our patented, innovative flat probe technology optimized electrical and mechanical performance. ECT offers ZIP in two high performance versions: Z1 and Z0”.

Z1 is ECT’s high bandwidth series with a test height of 2.7 mm. It offers an insertion loss of approximately 30 Ghz at -1 dB. Z0 is ECT’s ultra-high bandwidth series. Z0’s short test height of 1.5 mm and 0.60 nH of inductance provides an insertion loss of 40 Ghz at -1 dB. The probes are available for semiconductor packages with a pitch down to 0.4 mm and are applicable for a wide range of RF testing of applications from lab and characterization to burn-in to high volume final test.

Read more about Semiconductor Probes

Xcerra™ to present at Semicon Europa 2014

The new brand in the electronics supply chain dedicated to your success

Xcerra Corporation announces that Peter Cockburn, Senior Product Manager of Test Cell Innovation, will give a presentation at the upcoming Semicon Europa trade show, scheduled to take place October 7-9 in Grenoble, France. Peter will present “Using a Test-Cell-Solution Approach to Achieve Device Quality and Production-Efficiency Goals for 77GHz Automotive Radar ICs” on Wednesday, October 8, 2014 at 1:50 p.m. in session 1 “System-Level Approaches for Optimizing Test” of the 16th European Manufacturing and Test Conference (EMTC). The presentation has been co-authored by Mauro Strazzeri of STMicroelectronics.

Legislation to reduce car injuries is causing dramatic growth in ADAS (Advanced Driver Assistance Systems). Radar-based ADAS are moving from 24GHz to 77GHz, providing better range, bandwidth and resolution for detecting objects. Automotive 0 ppm failure rates necessitate full functional test of the ADAS ICs at 24GHz or 77GHz in both engineering and high volume manufacturing (HVM).

Specialized ATE solutions may be under-utilized as requirements change and are not well adapted for HVM. An ideal solution should be usable with different RF and Automotive applications.

A co-development between ST and Xcerra has already implemented 28GHz RF test to maintain the highest quality levels. This is based on a flexible test cell base that can be used for other requirements and a system-level solution to maximize OEE and minimize cost. The test cell is now being extended to provide a 77GHz test solution.

The device under test (DUT) has 38GHz IF and several 77GHz TxRx to implement a multiple beam solution for best performance. The DUT also uses >1 Gigabit serial I/O to facilitate high speed data transfer.

The test cell uses a low-cost 6GHz subsystem and optional radar frequency test modules to balance flexibility and cost of full-speed test.

An integrated test cell design of the complete signal path, from RF instrumentation, through the fixture and contactor to the DUT, is used to maintain 77GHz signal quality. Production contactors are required for WLCSP and packaged devices. In-socket calibration verifies signal performance at the DUT.

Because automotive ICs operate at extended hot and cold temperatures, a “trip-temp” handler ensures the highest test coverage. A system-level mechanical design enables temperature accuracy of +/-2 DegC.

In conclusion, the customer‘s DUT is tested to the highest levels of coverage, to guarantee quality at the OEMs. The vendor has proven an optimized test cell approach to provide a cost-effective solution with the highest OEE.

Peter Cockburn has worked in the ATE industry for over 24 years at Schlumberger, NPTest, Credence, LTX-Credence and now Xcerra. He has developed real-time and GUI software for ATE systems, managed the launch of several SOC ATE systems and new analog test options and provided marketing and sales support in USA, Asia and Europe. As Product Manager in the Test Cell Innovation team, he is now defining new ways to reduce cost and increase uptime when testing semiconductors. He has an Engineering degree from the University of Southampton, UK.